Henkel Corporation - Electronics Hysol GR750 8799375032321

Description
Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.
  • Hysol GR750 - 8799375032321 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.

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Hysol GR750 - 8799375032321 - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
Hysol GR750
8799375032321
Hysol GR750 8799375032321
Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.

Hysol® GR750™ are high thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.

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Technical Specifications

  Henkel Corporation - Electronics
Product Category Molding Compounds and Resins
Product Number 8799375032321
Product Name Hysol GR750
Filler Filler: Alumina Filler, Filler: Crystalline Filler, Green - Environmentally Responsible Material
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