Henkel Corporation - Electronics Hysol GR750 8799375032321

Description

Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.

Henkel Corporation - Electronics

Description

Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.

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Company

Product

Description

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Henkel Corporation - Electronics

Irvine, CA, USA

Hysol GR750
8799375032321

Hysol GR750 8799375032321

Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys.

Supplier's Site

Technical Specifications

	Henkel Corporation - Electronics
Product Category	Molding Compounds and Resins
Product Number	8799375032321
Product Name	Hysol GR750
Filler	Filler: Alumina Filler, Filler: Crystalline Filler, Green - Environmentally Responsible Material

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