Sensata Technologies Datasheets for IC Sockets and Headers

IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
IC Sockets and Headers: Learn more

Product Name Notes
1 1/4" x 1 1/4" "One Piece" for FlatPacks 1 1/4" x 1 1/4" "One Piece" for Flatpacks
29 Series 1 1/4 x 1 1/4 Pin Grid Array Carrier with Clip -- 29 Series 29 Series 1 1/4 x 1 1/4 Pin Grid Array Carrier with Clip
29 Series 3/4 x 1 Carrier for Straight Lead Flatpacks Devices -- 29 Series 29 Series 3/4 x 1 Carrier for Straight Lead Flatpacks Devices
Carriers for "J" Lead Devices Carriers for "J" Lead Devices
Two Piece 1 1/4" x 1 1/4" Carrier for LSI Devices Two Piece 1 1/4" x 1 1/4" Carrier for LSI Devices
Two Piece 2" x 2" Carrier for LSI Devices Two Piece 2" x 2" Carrier for LSI Devices
678 Series "Dual Pinch" highly reliable contacts Separate contacts for interfacing with heat slug Open top, zero insertion force for automatic loading Compact size for high board density Thru hole design
772 Series CSP/FBGA Devices -- 772 Series 0.4mm pitch for large array Compression surface mount Support up to 34x34 ball matrix Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition...
773 Series CSP/FBGA Devices -- 773 Series 0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle beam contact supports any type of solder ball
790 Series QFN Devices -- 790 Series 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on...
776 Series 0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact "U" contact supports any type of solder ball shape and composition Compact outline...
774 Series CSP/FBGA Devices -- 774 Series 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckling beam contact provides stable contact performance independent of solder...
775 Series CSP/FBGA Devices -- 775 Series 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckling beam contact supports any type solder ball shape and...
775E Series CSP/FBGA Devices -- 775E Series 0.8mm Pitch Compression surface mount Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition Compact outline and low actuation force achieved through use of...
621 Series Compact Version .030" Pitch FlatPack Contactor 3/4" x 1" Carrier -- 621 Series 20, 22, 24 and 28-lead contractors on .030" centers Easy insertion of device leads For temperatures up to 150°C
29 Series Two Piece 2x2 Universal Pin Grid Array Carrier with Clip -- 29 Series Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissipative (ESD) materials Designed to be used with automatic test handlers...
628 Series FlatPack Contactor for 1 1/4" x 1 1/4" Carrier -- 628 Series Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless steel latch that's easy-to-operate Reduced-force contacts eliminate damage to device...
717 Series QFN/LGA Devices Lidded -- 717 Series Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locater plate Pointed top interface to DUT pad Multi-site...
718 Series CSP/BGA/QFN Devices Lidded -- 718 Series Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or...
613 Series Dual In-Line Packages (DIP) -- 613 Series
656T Series SSOP with Center Pad Connection Devices ZIF -- 656T Series
Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe contacts for long, dependable life Excellent component clearance under the socket...
647 Series PLCC Devices -- 647 Series Direct entry with zero insertion force Series 647A dead bug device insertion Series 647C live bug device insertion Heat evenly dissipates on all four sides Designed-in contact over-stress protection Top...
Carriers for Standard to Device Flat surface built into every other thru lead hole to hold the device securely during bowl feeding or handling Many custom versions also available
72X Series CSP/BGA/QFN Devices Lidded -- 72X Series Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement HTOL...
646 Series FlatPack Contactor for 1 1/4" x 1 1/4" Carrier -- 646 Series Latch features manual/automatic release Beryllium Copper stamped contacts plated with 30 microinches of gold 28, 32, 36, 48, and 56-lead Preloaded high normal force contacts For temperatures up to 150°C...
890 Series CSP/BGA/QFN Devices -- 890 Series Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers...
625 Series Quad Pack Contactor for 2"x2" Carrier -- 625 Series Low profile... less than .780" off printed circuit board Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless steel latch Four 0.125" diameter mounting holes for bolting socket to...
612 Series TO Pin Circle Devices -- 612 Series Low-insertion force Large entry area for easy insertion of device leads Polarized to BIB, not to device Four solder hold down pins For temperatures up to 150°C
2" x 2" Slide Lock Carrier Manual release feature Designed for heavy IC packages
619 Series Penultimate Contactor for 2'x2' Carrier -- 619 Series Mechanical Advantage Latch provides easy operation Preloaded high normal force contacts on .025" and .050" centers Teflon® coated base to ESD level Plastic base insert encases by metal permits elevated...
611 Series TO Pin Circle Devices -- 611 Series Molded guides prevent "stubbing" of device leads Low-insertion force contacts with large target area Retention Feature on the tails Polarized to BIB, not to device Center hold down pin For...
629 Series Quad Pacl Contactor for 1 1/4" x 1 1/4" Carrier -- 629 Series One-piece, non-corrosive stainless steel latch Easy loading of carrier and IC device Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down provides positive contact, preventing the carrier...
777 Series CSP Devices -- 777 Series Open top chip scale package and fine pitch BGA's Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size and low actuation force 4-Point pitch contact design for enhanced electrical...
680 Series QFP Devices Dual Pinch -- 680 Series Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam contact design. "H" version. Lid actuation force peaks during stroke and...
656 Series SSOP Devices ZIF -- 656 Series Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm Optional thermal pin...
652 Series SOP Devices ZIF -- 652 Series Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Thru hole design High force contact version (H) available for Pb-free...
652D Series Dual Beam SOP Devices ZIF -- 652D Series Open top, Zero Insertion Force design for automatic loading Compact size for high board density Two points of contact per device lead Lead scrub for superior connection and consistent performance...
676 Series TSSOP Devices Dual Pinch ZIF -- 676 Series Open top, zero insertion force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion Thru hole design
715 Series CSP/BGA/QFN Devices Open Top -- 715 Series Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate...
716 Series QFN/LGA Devices Open Top -- 716 Series Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch...
3000 QFP & TQFP -- 3000 Open Top Reduced Lid Activation Force Auto Load Compatible Package Alignment 0.4mm pitch Corner Lead Guide plus Alignment Rails 0.5mm pitch Corner Lead Guide Modular tooling provides maximum flexibility to...
29 Series Two Piece 3/4 x 1 Carrier for Flatpacks with Straight Leads -- 29 Series Over 100 standard carriers in addition to thousands of custom versions More designs and tooling than any other manufacturer Can be molded of Electro-Static-Dissipative (ESD) materials Used to fully automate...
626 Series FlatPack Contactor for 2"x2" Carrier -- 626 Series Stainless steel latch with long-lasting metal latch and hinge pins Beryllium Copper Allow contacts plated with 30 microinches of gold Smooth, radius-probing contacts Latch hold down directly over the contacts...
621 Series Standard Version .050" Pitch FlatPack Contactor for 3/4" x 1" Carrier -- 621 Series Standard 30 microinches of select gold plating over 50 microinches of nickel Easy-to-operate Latch stop prevents shorting if carrier is not in proper position Unique latch design provides positive contact...
860 Series CSP/BGA/QFN Devices -- 860 Series Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless...
499 Series TO/SOT Devices -- 499 Series Wide product selection Gold contact plating High temperature materials Low insertion force Small outlines for greater board density