Sensata Technologies Datasheets for IC Sockets and Headers

IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
IC Sockets and Headers: Learn more

Product Name Notes
1 1/4" x 1 1/4" "One Piece" for Flatpacks
29 Series 1 1/4 x 1 1/4 Pin Grid Array Carrier with Clip
29 Series 3/4 x 1 Carrier for Straight Lead Flatpacks Devices
Carriers for "J" Lead Devices
Two Piece 1 1/4" x 1 1/4" Carrier for LSI Devices
Two Piece 2" x 2" Carrier for LSI Devices
"Dual Pinch" highly reliable contacts Separate contacts for interfacing with heat slug Open top, zero insertion force for automatic loading Compact size for high board density Thru hole design
0.4mm pitch for large array Compression surface mount Support up to 34x34 ball matrix Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition...
0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle beam contact supports any type of solder ball
0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on...
0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact "U" contact supports any type of solder ball shape and composition Compact outline...
0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckling beam contact provides stable contact performance independent of solder...
0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckling beam contact supports any type solder ball shape and...
0.8mm Pitch Compression surface mount Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition Compact outline and low actuation force achieved through use of...
20, 22, 24 and 28-lead contractors on .030" centers Easy insertion of device leads For temperatures up to 150°C
Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissipative (ESD) materials Designed to be used with automatic test handlers...
Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless steel latch that's easy-to-operate Reduced-force contacts eliminate damage to device...
Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locater plate Pointed top interface to DUT pad Multi-site...
Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or...
Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe contacts for long, dependable life Excellent component clearance under the socket...
Direct entry with zero insertion force Series 647A dead bug device insertion Series 647C live bug device insertion Heat evenly dissipates on all four sides Designed-in contact over-stress protection Top...
Flat surface built into every other thru lead hole to hold the device securely during bowl feeding or handling Many custom versions also available
Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement HTOL...
Latch features manual/automatic release Beryllium Copper stamped contacts plated with 30 microinches of gold 28, 32, 36, 48, and 56-lead Preloaded high normal force contacts For temperatures up to 150°C...
Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers...
Low profile... less than .780" off printed circuit board Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless steel latch Four 0.125" diameter mounting holes for bolting socket to...
Low-insertion force Large entry area for easy insertion of device leads Polarized to BIB, not to device Four solder hold down pins For temperatures up to 150°C
Manual release feature Designed for heavy IC packages
Mechanical Advantage Latch provides easy operation Preloaded high normal force contacts on .025" and .050" centers Teflon® coated base to ESD level Plastic base insert encases by metal permits elevated...
Molded guides prevent "stubbing" of device leads Low-insertion force contacts with large target area Retention Feature on the tails Polarized to BIB, not to device Center hold down pin For...
One-piece, non-corrosive stainless steel latch Easy loading of carrier and IC device Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down provides positive contact, preventing the carrier...
Open top chip scale package and fine pitch BGA's Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size and low actuation force 4-Point pitch contact design for enhanced electrical...
Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam contact design. "H" version. Lid actuation force peaks during stroke and...
Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm Optional thermal pin...
Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Thru hole design High force contact version (H) available for Pb-free...
Open top, Zero Insertion Force design for automatic loading Compact size for high board density Two points of contact per device lead Lead scrub for superior connection and consistent performance...
Open top, zero insertion force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion Thru hole design
Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate...
Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch...
Open Top Reduced Lid Activation Force Auto Load Compatible Package Alignment 0.4mm pitch Corner Lead Guide plus Alignment Rails 0.5mm pitch Corner Lead Guide Modular tooling provides maximum flexibility to...
Over 100 standard carriers in addition to thousands of custom versions More designs and tooling than any other manufacturer Can be molded of Electro-Static-Dissipative (ESD) materials Used to fully automate...
Stainless steel latch with long-lasting metal latch and hinge pins Beryllium Copper Allow contacts plated with 30 microinches of gold Smooth, radius-probing contacts Latch hold down directly over the contacts...
Standard 30 microinches of select gold plating over 50 microinches of nickel Easy-to-operate Latch stop prevents shorting if carrier is not in proper position Unique latch design provides positive contact...
Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless...
Wide product selection Gold contact plating High temperature materials Low insertion force Small outlines for greater board density