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Sensata Technologies 656 Series SSOP Devices ZIF

Description
Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm Optional thermal pin for package Heat Sink (consult factory) Thru hole design High force contact version (H) available for Pb free packages (single beam type)
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656 Series SSOP Devices ZIF -  - Sensata Technologies
Attleboro, MA, USA
656 Series SSOP Devices ZIF
656 Series SSOP Devices ZIF
Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm Optional thermal pin for package Heat Sink (consult factory) Thru hole design High force contact version (H) available for Pb free packages (single beam type)
  • Open top, zero insertion force design for automatic loading
  • Compact size for high board density
  • Highly reliable, pre-loaded contacts
  • Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm
  • Optional thermal pin for package Heat Sink (consult factory)
  • Thru hole design
  • High force contact version (H) available for Pb free packages (single beam type)
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 656 Series SSOP Devices ZIF
Product Type IC Socket
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