0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and compression
Advanced latch mechanism with flexible pressure pads provides uniformed force distribution across the package surface, enabling the socket to handle up to 900 balls (full 30x30 matrix) and super thin packages.
Sensata Technologies
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Description
0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and compression
Advanced latch mechanism with flexible pressure pads provides uniformed force distribution across the package surface, enabling the socket to handle up to 900 balls (full 30x30 matrix) and super thin packages.
0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and compression
Advanced latch mechanism with flexible pressure pads provides uniformed force distribution across the package surface, enabling the socket to handle up to 900 balls (full 30x30 matrix) and super thin packages.
0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and compression
Advanced latch mechanism with flexible pressure pads provides uniformed force distribution across the package surface, enabling the socket to handle up to 900 balls (full 30x30 matrix) and super thin packages.
