Sensata Technologies Datasheets for IC Interconnect Components
IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
IC Interconnect Components: Learn more
| Product Name | Notes |
|---|---|
| 1 1/4" x 1 1/4" "One Piece" for Flatpacks | |
| 29 Series 1 1/4 x 1 1/4 Pin Grid Array Carrier with Clip | |
| 29 Series 3/4 x 1 Carrier for Straight Lead Flatpacks Devices | |
| Carriers for "J" Lead Devices | |
| Two Piece 1 1/4" x 1 1/4" Carrier for LSI Devices | |
| Two Piece 2" x 2" Carrier for LSI Devices | |
| "Dual Pinch" highly reliable contacts Separate contacts for interfacing with heat slug Open top, zero insertion force for automatic loading Compact size for high board density Thru hole design | |
| 0.4mm pitch for large array Compression surface mount Support up to 34x34 ball matrix Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition... | |
| 0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle beam contact supports any type of solder ball | |
| 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for BIB design consideration ACTIVE ALIGNMENT: Active IC guide feature improving on... | |
| 0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact "U" contact supports any type of solder ball shape and composition Compact outline... | |
| 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckling beam contact provides stable contact performance independent of solder... | |
| 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckling beam contact supports any type solder ball shape and... | |
| 0.8mm Pitch Compression surface mount Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition Compact outline and low actuation force achieved through use of... | |
| 20, 22, 24 and 28-lead contractors on .030" centers Easy insertion of device leads For temperatures up to 150°C | |
| Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissipative (ESD) materials Designed to be used with automatic test handlers... | |
| Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless steel latch that's easy-to-operate Reduced-force contacts eliminate damage to device... | |
| Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locater plate Pointed top interface to DUT pad Multi-site... | |
| Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locator plate Multi-site options are available Any pitch or... | |
| Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe contacts for long, dependable life Excellent component clearance under the socket... | |
| Direct entry with zero insertion force Series 647A dead bug device insertion Series 647C live bug device insertion Heat evenly dissipates on all four sides Designed-in contact over-stress protection Top... | |
| Flat surface built into every other thru lead hole to hold the device securely during bowl feeding or handling Many custom versions also available | |
| Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement HTOL... | |
| Latch features manual/automatic release Beryllium Copper stamped contacts plated with 30 microinches of gold 28, 32, 36, 48, and 56-lead Preloaded high normal force contacts For temperatures up to 150°C... | |
| Lid and adapter molded to allow low cost solutions High force delivery system (up to 40lbf) A variety of contact technologies can be used for this socket ranging from elastomers... | |
| Low profile... less than .780" off printed circuit board Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless steel latch Four 0.125" diameter mounting holes for bolting socket to... | |
| Low-insertion force Large entry area for easy insertion of device leads Polarized to BIB, not to device Four solder hold down pins For temperatures up to 150°C | |
| Manual release feature Designed for heavy IC packages | |
| Mechanical Advantage Latch provides easy operation Preloaded high normal force contacts on .025" and .050" centers Teflon® coated base to ESD level Plastic base insert encases by metal permits elevated... | |
| Molded guides prevent "stubbing" of device leads Low-insertion force contacts with large target area Retention Feature on the tails Polarized to BIB, not to device Center hold down pin For... | |
| One-piece, non-corrosive stainless steel latch Easy loading of carrier and IC device Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down provides positive contact, preventing the carrier... | |
| Open top chip scale package and fine pitch BGA's Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size and low actuation force 4-Point pitch contact design for enhanced electrical... | |
| Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam contact design. "H" version. Lid actuation force peaks during stroke and... | |
| Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm Optional thermal pin... | |
| Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Thru hole design High force contact version (H) available for Pb-free... | |
| Open top, Zero Insertion Force design for automatic loading Compact size for high board density Two points of contact per device lead Lead scrub for superior connection and consistent performance... | |
| Open top, zero insertion force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion Thru hole design | |
| Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate... | |
| Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch... | |
| Open Top Reduced Lid Activation Force Auto Load Compatible Package Alignment 0.4mm pitch Corner Lead Guide plus Alignment Rails 0.5mm pitch Corner Lead Guide Modular tooling provides maximum flexibility to... | |
| Over 100 standard carriers in addition to thousands of custom versions More designs and tooling than any other manufacturer Can be molded of Electro-Static-Dissipative (ESD) materials Used to fully automate... | |
| Stainless steel latch with long-lasting metal latch and hinge pins Beryllium Copper Allow contacts plated with 30 microinches of gold Smooth, radius-probing contacts Latch hold down directly over the contacts... | |
| Standard 30 microinches of select gold plating over 50 microinches of nickel Easy-to-operate Latch stop prevents shorting if carrier is not in proper position Unique latch design provides positive contact... | |
| Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless... | |
| Wide product selection Gold contact plating High temperature materials Low insertion force Small outlines for greater board density |