Henkel Corporation - Industrial Datasheets for Epoxy Adhesives
Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Epoxy Adhesives: Learn more
| Product Name | Notes |
|---|---|
| 1-part, non-sag, fast cure epoxy adhesive paste. The product is ideal for bonding wires to armatures. LOCTITE® EA 3985 is a black, 1-part, non-sag, fast cure epoxy adhesive paste. The... | |
| 2-part industrial grade epoxy adhesive. It cures at room temperature to form a tough bondline with excellent resistance to peel and impact forces. LOCTITE® EA E-120HP is an amber-beige, 2-part,... | |
| 2-part, industrial grade, high viscosity, room temperature-cure structural epoxy adhesive which contains DuPont's Kevlar®. LOCTITE® EA E-30UT is a dark purple, 2-part, industrial grade, high viscosity, room temperature-cure structural epoxy... | |
| 2-part, low viscosity, industrial grade epoxy adhesive. It cures at room temperature with minor shrinkage to form an ultra clear adhesive bondline. LOCTITE®EA E-30CL is a clear, colorless to slightly... | |
| 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. LOCTITE® EA E-40HT is an off-white, 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive... | |
| Clear, two-component, 5-minute epoxy in a convenient 1:1 mix ratio. Bonds virtually any material. It will also fill or seal cracks and rebuild worn surfaces. Sets in 5 minutes allowing... | |
| Epoxy black 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE® EA 11C is a black, 2-part, epoxy, general purpose adhesive and sealant that is suitable... | |
| Epoxy colorless/slightly yellowish adhesive for applications demanding high structural, mechanical, and electrical insulating properties. LOCTITE® EA 3336 is a colorless to slightly yellowish, 2-part, medium-viscosity, epoxy adhesive liquid for potting,... | |
| Epoxy light white translucent adhesive for electronic component bonding applications. A set open time following activation allows component assembly. LOCTITE® EA 3355 is a translucent, light white, medium-viscosity, cationic epoxy... | |
| Epoxy off-white 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE® EA 1C is an off-white, 2-part, epoxy, general purpose adhesive and sealant that can be... | |
| Epoxy translucent 2-part adhesive for general purpose applications. Bonds most materials and is effective at filling porosities and voids. LOCTITE® EA 9131 is a translucent, 2-part, epoxy, general purpose adhesive... | |
| Extreme temperature, silicic acid, water-based repair putty that withstands environments up to 2,000 °F (1,000 °C). LOCTITE® MR 2000 is a silver gray, extreme temperature, silicic acid, water-based repair putty... | |
| General purpose, one-part silicone adhesive sealant which cures at room temperature to form a tough rubber seal. LOCTITE® SI 593 BLACK is a black, general purpose, one-part silicone adhesive sealant... | |
| LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W... | |
| LOCTITE 3614, Epoxy, Surface mount adhesive LOCTITE® 3614 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where... | |
| LOCTITE 3616, Epoxy, Surface mount adhesive, Small parts bonding LOCTITE® 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited... | |
| LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited... | |
| LOCTITE 3626M, Epoxy, Halogen free, High thermal mechanical strength, Surface mount adhesive LOCTITE® 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. | |
| LOCTITE 3629C, Epoxy, Surface mount adhesive LOCTITE® 3629C epoxy is formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed provide controlled dot... | |
| LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC. | |
| LOCTITE ABLESTIK 16-1LV, Epoxy, General Assembly LOCTITE® ABLESTIK 16-1LV epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. This... | |
| LOCTITE ABLESTIK 2106T BIPAX, Epoxy, Assembly LOCTITE® ABLESTIK 2106T BIPAX is designed for high strength structural bonding applications. LOCTITE ABLESTIK 2106T BIPAX develops significant properties 1 hour after mixing. Two... | |
| LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily... | |
| LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to... | |
| LOCTITE ABLESTIK 2143D, Epoxy, Medium viscosity adhesive, Assembly LOCTITE® ABLESTIK 2143D medium viscosity adhesive is recommended for industrial bonding and sealing applications where toughness, impact resistance and superior mechanical properties... | |
| LOCTITE ABLESTIK 2158 BIPAX, Epoxy, a Two-part Adhesive, Electrically Insulating, Assembly, NCA LOCTITE® ABLESTIK 2158 BIPAX is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which... | |
| LOCTITE ABLESTIK 2332-17, Solventless Epoxy, Assembly LOCTITE® ABLESTIK 2332-17 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It... | |
| LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds... | |
| LOCTITE ABLESTIK 285 CAT 11, Epoxy, Thermally conductive adhesive LOCTITE® ABLESTIK 285 CAT 11 adhesive is designed for assembly applications that require thermal management. It is also recommended for low... | |
| LOCTITE ABLESTIK 2902, Epoxy, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2902 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. LOCTITE... | |
| LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. | |
| LOCTITE ABLESTIK 293-1, Epoxy, General Assembly LOCTITE® ABLESTIK 293-1 is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates. One component - requires no mixing General purpose... | |
| LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach... | |
| LOCTITE ABLESTIK 342-3.5, Epoxy, General Assembly LOCTITE® ABLESTIK 342-3.5 epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. LOCTITE... | |
| LOCTITE ABLESTIK 369-3, Epoxy, Die Attach, Polyamine Activated Adhesive LOCTITE® ABLESTIK 369-3 polyamine activated adhesive is designed for general purpose applications. Electrically conductive Ease of use Long work life Moderate... | |
| LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can... | |
| LOCTITE ABLESTIK 45, Epoxy, Assembly, General purpose, Adhesive LOCTITE® ABLESTIK 45 is designed as a general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to... | |
| LOCTITE ABLESTIK 5020K, Epoxy Film, Assembly, High Purity Adhesive LOCTITE® ABLESTIK 5020K high purity adhesive is designed for substrate attach. Thermally conductive High purity | |
| LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not... | |
| LOCTITE ABLESTIK 550, Epoxy Film, Assembly LOCTITE® ABLESTIK 550 adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during... | |
| LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding High thermal conductivity Low cure temperature Suitable for an array of difficult-to-bond... | |
| LOCTITE ABLESTIK 561, Epoxy Film, Assembly LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined... | |
| LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It... | |
| LOCTITE ABLESTIK 564A, Epoxy Film, Assembly LOCTITE® ABLESTIK 564A adhesive film is designed for bonding hybrid substrates into packages. In centrifuge tests, this adhesive passed 15,000 gs. Electrically Insulating High... | |
| LOCTITE ABLESTIK 566K, Epoxy Film, Assembly LOCTITE® ABLESTIK 566K is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. This material is a low temperature cure version of... | |
| LOCTITE ABLESTIK 566KAP, Epoxy Film, Assembly LOCTITE® ABLESTIK 566KAP is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. Extremely flexible Low temperature cure Good insulator | |
| LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly LOCTITE® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to... | |
| LOCTITE ABLESTIK 57C, Epoxy, Assembly LOCTITE® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the... | |
| LOCTITE ABLESTIK 64C, Epoxy, Assembly LOCTITE® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea... | |
| LOCTITE ABLESTIK 77-2LTC, Epoxy, Adhesive LOCTITE® ABLESTIK 77-2LTC adhesive is designed for attaching surface mounted devices to printed circuit boards prior to wave solder. Small, uniform dots may be dispensed... | |
| LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive... | |
| LOCTITE ABLESTIK 8290, Epoxy, Die attach LOCTITE® ABLESTIK 8290 electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. It is recommended for die sizes <200 mils... | |
| LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated... | |
| LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be... | |
| LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive Black pigmentation for blocking stray light | |
| LOCTITE ABLESTIK 83CJ, Epoxy, Assembly LOCTITE® ABLESTIK 83CJ adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations... | |
| LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand... | |
| LOCTITE ABLESTIK 84-1LMINB, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMINB electrically conductive adhesive is designed for die attach applications. Electrically conductive High purity die attach adhesive Solvent-free | |
| LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or... | |
| LOCTITE ABLESTIK 84-3, Epoxy, Die attach LOCTITE® ABLESTIK 84-3 adhesive is designed for medium die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand. | |
| LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced... | |
| LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion... | |
| LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. Non-conductive Stress absorbing | |
| LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of... | |
| LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed... | |
| LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate... | |
| LOCTITE ABLESTIK 970-1N1, Epoxy, High Strength, General Assembly LOCTITE® ABLESTIK 970-1N1 is a general purpose adhesive which develops high strength on a wide range of substrates General purpose Sag resistant... | |
| LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure... | |
| LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low... | |
| LOCTITE ABLESTIK C 805-1, Epoxy, Heat cure LOCTITE® ABLESTIK C 805-1 is the lower viscosity version of ECCOBOND C 805. Electrically conductive Thermally conductive Thixotropic Bond strength Good adhesion to... | |
| LOCTITE ABLESTIK C850-6L, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK C850-6L electrically conductive adhesive is designed for LED die bonding and other die attach applications. Electrically conductive One component Low cure... | |
| LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique... | |
| LOCTITE ABLESTIK CE 3511PHV, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3511PHV electrically conductive adhesive is designed for circuit assembly applications. Electrically conductive One component Fast cure at high temperatures... | |
| LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed... | |
| LOCTITE ABLESTIK CE 3514-1, Epoxy, Assembly, ECA LOCTITE® ABLESTIK CE 3514-1 is designed for heat sensitive applications requiring a low cure temperature. Please refer to the TDS for alternate cure... | |
| LOCTITE ABLESTIK CE 3520-3, Epoxy, Electrically Conductive Adhesive LOCTITE® ABLESTIK CE 3520-3 adhesive combines a high elasticity with a good adhesion on a variety of surfaces, making it suitable for... | |
| LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF... | |
| LOCTITE ABLESTIK E 3040, Epoxy, Assembly LOCTITE® ABLESTIK E 3040 adhesive is designed for use in automated assembly operations. One component, requires no mixing Fast gel time Low viscosity Fluorescent... | |
| LOCTITE ABLESTIK E 3508 MOD3, Epoxy, Adhesive, Sealant, Assembly LOCTITE® ABLESTIK E 3508 MOD3 epoxy adhesive and sealant is designed for high throughput assembly operations. It is also recommended for... | |
| LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing... | |
| LOCTITE ABLESTIK ECF 561, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable | |
| LOCTITE ABLESTIK ECF 564AHF, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 564AHF adhesive film is designed for use in hybrid packages where outgassing and ionic contamination must be kept to a... | |
| LOCTITE ABLESTIK ECF 568, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 568 high purity adhesive is designed for substrate attach. This material is a low temperature cure version of ABLEFILM 550... | |
| LOCTITE ABLESTIK EO 0206, Epoxy, Adhesive LOCTITE® ABLESTIK EO 0206 epoxy system is designed for use on electronic devices. One component Non-sag Low halogen content | |
| LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents,... | |
| LOCTITE ABLESTIK FDA 2T, Epoxy, Medical LOCTITE® ABLESTIK FDA 2T is designed for medical device applications. LOCTITE ABLESTIK FDA 2T bonds offer resistance to water, weather, galvanic action, petroleum solvents,... | |
| LOCTITE ABLESTIK FDA 8, Epoxy, Medical LOCTITE® ABLESTIK FDA 8 is designed for bonding and coating applications. LOCTITE ABLESTIK FDA 8 bonds offer resistance to water and weathering, galvanic action,... | |
| LOCTITE ABLESTIK G 500HF, Epoxy, Assembly LOCTITE® ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. One component Sag resistant Process... | |
| LOCTITE ABLESTIK G 757, Epoxy, Assembly LOCTITE® ABLESTIK G 757 is specially designed to bond automobile headlamp lenses to reflectors. One component Thixotropic Bonds to a wide variety of substrates... | |
| LOCTITE ABLESTIK G 909, Epoxy, Assembly LOCTITE® ABLESTIK G 909 is designed for very high strength structural bonding especially for dissimilar substrates that will be exposed to a wide range... | |
| LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component Oxide filled Low... | |
| LOCTITE ABLESTIK NCA 2350, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK NCA 2350 is designed for use in heat sensitive devices. Fast cure at low temperature One component Good adhesion | |
| LOCTITE ABLESTIK NCA 2360, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK NCA 2360 is designed for use in heat sensitive devices One component Fast cure at low temperature Good adhesion | |
| LOCTITE ABLESTIK NCA 3280, Epoxy, Rapid Cure, Non-conductive Adhesive LOCTITE® ABLESTIK NCA 3280 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high... | |
| LOCTITE ABLESTIK NCA 3285, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3285 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in... | |
| LOCTITE ABLESTIK S3869, Silicone Epoxy Resin, Die Attach, Thermosetting, Dielectric Adhesive LOCTITE® ABLESTIK S3869 is a thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong... | |
| LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend... | |
| LOCTITE ABLESTIK XCE 3111, Epoxy Hybrid, One Component, Electrically Conductive Adhesive LOCTITE® ABLESTIK XCE 3111 one component adhesive is designed for die strap to antenna attach of RFID inlay applications. | |
| LOCTITE CB 3626MHF, Epoxy, Component assembly, NCA, Surface mount adhesive LOCTITE® CB 3626MHF is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. This... | |
| LOCTITE ECCOBOND BF 4, Epoxy, Die Attach LOCTITE® ECCOBOND BF 4 adhesive is designed to encapsulate, protect and provide a structural bond for optoelectronic applications. This material compliments the use... | |
| LOCTITE ECCOBOND F 112, Epoxy, Assembly LOCTITE® ECCOBOND F 112 adhesive is formulated for fiber optic assembly applications. Two components - requires mixing Low viscosity Thermal shock and impact resistant... | |
| LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and... | |
| LOCTITE ECCOBOND F 120, Epoxy, Assembly LOCTITE® ECCOBOND F 120 adhesive is designed for high performance fiber optic and optical bonding applications. This adhesive provides outstanding chemical resistance to a... | |
| LOCTITE ECCOBOND F 123, Epoxy, Assembly LOCTITE® ECCOBOND F 123 is formulated for terminating single or multi-channel fiber optic connectors. LOCTITE ECCOBOND F 123 bonds offer resistance to water and... | |
| LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA LOCTITE® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its... | |
| LOCTITE ECCOBOND F 253, Two-part, Epoxy, Assembly LOCTITE® ECCOBOND F 253 two-part epoxy is formulated to change color during the cure process to indicate the cure status. LOCTITE ECCOBOND F... | |
| LOCTITE ECCOBOND LUX 4047, Acrylate, Assembly, Photocurable Adhesive LOCTITE® ECCOBOND LUX 4047 photocurable adhesive is designed for high throughput optoelectronic assembly operations. This adhesive cures in seconds when exposed to... | |
| LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This... | |
| LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating... | |
| LOCTITE STYCAST EO 8019, Epoxy, Potting and Encapsulating, Resilient, Non-sag, Heat Cure Glass adhesive LOCTITE STYCAST EO 8019 epoxy, is a resilient, non-sag, heat cure glass adhesive. Non-sag properties are... | |
| LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and... | |
| LOCTITE STYCAST ESP 4536, Epoxy, Fast-setting, Industrial Grade, Surface Mounted Devices LOCTITE® STYCAST ESP 4536 is a fast-setting, industrial grade surface mount adhesive. It is designed to set quickly when... | |
| LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic,... | |
| Off-white, 2-part, epoxy adhesive which cures at room temperature to form a tough bondline providing high peel resistance and high shear strengths. LOCTITE® EA M-21HP is an off-white, 2-part, epoxy... | |
| Room temperature-cure, toughened, medium viscosity, industrial grade structural epoxy adhesive with a medium working life. LOCTITE® EA E-40FL is a gray, opaque, room temperature-cure, toughened, medium viscosity, industrial grade structural... | |
| Thixotropic, heat-cured, industrial grade structural epoxy adhesive paste with tough, strong bonds with excellent peel resistance and impact strength. LOCTITE® EA E-214HP is a light gray, thixotropic, heat-cured, industrial grade... | |
| To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing... | |
| Toughened, medium-viscosity, room temperature cure, industrial grade epoxy adhesive with extended work life. LOCTITE® EA E-60HP is an off-white, toughened, medium-viscosity, room temperature cure, industrial grade epoxy adhesive with extended... | |
| Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface... |