Henkel Corporation - Industrial Datasheets for Electrical Insulation and Dielectric Materials

Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Electrical Insulation and Dielectric Materials: Learn more

Product Name Notes
LOCTITE ABLESTIK 104, Epoxy, Assembly LOCTITE® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230ºC.
LOCTITE ABLESTIK 2025D, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025D die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates...
LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging. Non-conductive High reliability Improved work life
LOCTITE ABLESTIK 2025JH, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 2025JH die attach adhesive is designed for use in array packaging. Minimum bleed Good adhesion to a variety of substrates...
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material...
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for...
LOCTITE ABLESTIK 2053S, Epoxy, Die Attach LOCTITE® ABLESTIK 2053S die attach adhesive is designed for use in array packaging. Low stress Non-conductive
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily...
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to...
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds...
LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can...
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive...
LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed...
LOCTITE ABLESTIK 816H01, Epoxy, Component assembly, Non-conductive adhesive LOCTITE® ABLESTIK 816H01 adhesive is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This...
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be...
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive Black pigmentation for blocking stray light
LOCTITE ABLESTIK 84-3, Epoxy, Die attach LOCTITE® ABLESTIK 84-3 adhesive is designed for medium die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound...
LOCTITE ABLESTIK 84-3MV, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3MV adhesive is designed for medium die attach applications. This adhesive is ideal for application by stamping or dispensing. Please refer to...
LOCTITE ABLESTIK 8700K, Epoxy, Die attach LOCTITE ABLESTIK 8700K adhesive provides excellent adhesion to thin film and thick film gold surfaces. This adhesive retains its dispensed height after cure, without...
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced...
LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach LOCTITE® ABLESTIK 8900NC die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size,...
LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. Non-conductive Stress absorbing
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure...
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package...
LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package...
LOCTITE ABLESTIK ABP 8035M, Silicone Hydrosilylation, Semiconductor material, Die Attach Adhesive LOCTITE® ABLESTIK ABP 8035M is a Non-conductive die attach adhesive designed for LED die attach applications. This silicone based...
LOCTITE ABLESTIK ABP 8142B3, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8142B3 non-conductive die attach adhesive is designed for MEMs package applications. Low modulus Black pigmentation for blocking light...
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8151D7 non-conductive die attach adhesive is designed for MEMs package applications. Electrically non-conductive Low modulus Low temperature cure...
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity...
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus...
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast...
LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product...
LOCTITE ABLESTIK NCA 3280, Epoxy, Rapid Cure, Non-conductive Adhesive LOCTITE® ABLESTIK NCA 3280 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high...
LOCTITE ABLESTIK NCA 3285, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3285 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in...
LOCTITE ABLESTIK NCA 3710H, High Viscosity, Epoxy, Semiconductor, Non-conductive adhesive LOCTITE® ABLESTIK NCA 3710H high viscosity epoxy adhesive is designed for use in camera module applications. It is formulated to...
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and...
LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive LOCTITE® ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates,...
LOCTITE ABLESTIK QMI536NB, Bismaleimide Resin, Die Attach, Low Bleed Non-conductive, PTFE-filled Paste LOCTITE® ABLESTIK QMI536NB is a low bleed non conductive, PTFE-filled paste designed for stacked die applications which require...
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties.
LOCTITE ABLESTIK QMI546, BMI, Die attach LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product...
LOCTITE ABLESTIK S3869, Silicone Epoxy Resin, Die Attach, Thermosetting, Dielectric Adhesive LOCTITE® ABLESTIK S3869 is a thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong...
LOCTITE ABLESTIK SF 40, Amine, Non-conductive adhesive LOCTITE® ABLESTIK SF 40 is a good choice for repairing vertical surfaces with little added weight. Please refer to the TDS for alternate...
LOCTITE ECCOBOND BF 4, Epoxy, Die Attach LOCTITE® ECCOBOND BF 4 adhesive is designed to encapsulate, protect and provide a structural bond for optoelectronic applications. This material compliments the use...
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive...
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering...
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used...
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance...
LOCTITE ECCOBOND LUX 3042M, Acrylate, Assembly, Dual Cure LOCTITE® ECCOBOND LUX 3042M dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is...
LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant LOCTITE® ECCOBOND PH 1 is a one component, non-conductive adhesive.  It has excellent ink resistance and has good adhesion to metal substrates and...
LOCTITE STYCAST 1265J, Epoxy, Encapsulant LOCTITE® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for...
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating.
LOCTITE® ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability. Non-conductive Fast cure Thin bondline Excellent gap filling...
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can...
LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip...