Shiu Li Technology Co., Ltd Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| LiPOLY AEM83 is an absorber pad, which is made of soft magnetic material and polymer resin. It can transfer electromagnetic radiation to thermal energy and lose it quickly. | |
| LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore 00/30, with high flexibility and compressibility. AS200 has ultra-low... | |
| LiPOLY AS400 is a thermally conductive gel designed for gap filling. The thermal conductivity is 4.0 W/m*K. The hardness is Shore 00/45, with high flexibility and compressibility. AS400 has ultra-low... | |
| LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. | |
| LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can... | |
| LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can... | |
| LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44... | |
| LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65... | |
| LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high... | |
| LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making... | |
| LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great... | |
| LiPOLY SH-putty3 is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our SH-putty3 can replace thermals pads in... | |
| LiPOLY T-pad900 is an ultra-soft, highly conformable, non-flammable interface material. T-pad900 is designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a... | |
| LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low... | |
| LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression,... | |
| LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an... | |
| LiPOLY TEM96B is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly... | |
| LiPOLY TPS96 is a two-pack epoxy material for gap filling. The viscosity and flowing is very low. The high deformation material , which can filling the gap closely, cover the... | |
| LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. | |
| LiPOLY’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can... | |
| LiPOLY’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can... | |
| LiPOLY’s PK504 is a material designed for gap filling. The thermal conductivity is 5.0W/m*K. The hardness is Shore 00/50 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can... | |
| LiPOLY’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which... | |
| LiPOLY’s PK700 is a material designed for gap filling. The thermal conductivity is 7.0 W/m*K. The hardness is Shore 00/55 with high flexibility, high compressibility, highly insulating, great self-adhesive, which... | |
| LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can... | |
| LiPOLY’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0... | |
| Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. | |
| Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can... | |
| Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material... |