Shiu Li Technology Co., Ltd High Ductile Thermal Conductive Pad S393

Description
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice for shock and tolerance absorbing.
Datasheet
Description
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice for shock and tolerance absorbing.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
High Ductile Thermal Conductive Pad - S393 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
High Ductile Thermal Conductive Pad
S393
High Ductile Thermal Conductive Pad S393
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice for shock and tolerance absorbing.

LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice for shock and tolerance absorbing.

Supplier's Site Datasheet

Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number S393
Product Name High Ductile Thermal Conductive Pad
Type / Form Sheet or Film
Chemical System Silicone
Features High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
Industry Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
Gap Fill 0.0197 to 0.3937 inch (0.5000 to 10 mm)
Unlock Full Specs
to access all available technical data

Similar Products

Sealants - 494102 - RS Components, Ltd.
RS Components, Ltd.
Specs
Industry Semiconductors, IC's; Copper, semiconductor junction protection
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant Part A 5 gal Can - EN-1556 PART A 5-GAL - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Polyurethane
Features Encapsulant, Potting Compound
View Details
Radiopaque Two Component Epoxy Compound - EP21BAS - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details