Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | N800C |
| Product Name | Non-Silicone Thermal Conductive Pad |
| Type / Form | Sheet or Film |
| Features | Thermally Conductive |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial |
| Gap Fill | 0.0197 to 0.1969 inch (0.5000 to 5 mm) |
