LiPOLY EP770 is a non-silicone, two-part thermal conductive sealing glue designed for gap filling applications. It features a thermal conductivity of 2.5 W/m*K and a low mixing viscosity of 2 Pa.s, allowing for easy application and dispersion. The product exhibits an extremely low shrinkage rate of 0.01%, ensuring minimal dimensional changes after curing. EP770 is based on epoxy resin, providing high hardness and structural support.
The curing process can be achieved at either 80°C for 1.5 hours or at room temperature (25°C) for 35 hours. It is suitable for a variety of applications, including use in electric vehicle motors, electronic components, and between heat-generating components and heat sinks. The product is compliant with ROHS and REACH standards and has a shelf life of 24 months when stored properly.
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar gap. Research and Development of LiPOLY is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP770 |
| Product Name | Non-Silicone Two-Part Thermal Conductive Sealing Glue |
| Chemical System | Epoxy |
| Features | Gap Filler, Foam in Place Gasket; Thermally Conductive |
| Industry | Electronics |
| Viscosity | 100000 cP |
