Shiu Li Technology Co., Ltd High Thermal Conductive Gap Filler T-top81

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High Thermal Conductive Gap Filler - T-top81 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
High Thermal Conductive Gap Filler
T-top81
High Thermal Conductive Gap Filler T-top81
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81 offers excellent performance at an extremely competitive price.

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81 offers excellent performance at an extremely competitive price.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number T-top81
Product Name High Thermal Conductive Gap Filler
Industry Electronics
Use Temperature -76 to 302 F (-60 to 150 C)
Dielectric Strength 203 kV/in (80 kV/cm)
Chemical System Silicone
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