Shiu Li Technology Co., Ltd Silicone Free Lightweight Thermal Conductive Putty NL-putty04-s

Description
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 4.0-10.0 W/m*K.
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Silicone Free Lightweight Thermal Conductive Putty - NL-putty04-s - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Silicone Free Lightweight Thermal Conductive Putty
NL-putty04-s
Silicone Free Lightweight Thermal Conductive Putty NL-putty04-s
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 4.0-10.0 W/m*K.

LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 4.0-10.0 W/m*K.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number NL-putty04-s
Product Name Silicone Free Lightweight Thermal Conductive Putty
Type / Form Gel; Liquid
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
Viscosity 2.50E6 cP
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