Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of 100-3000μm. The thermal conductivity of the H-putty series is 2.0/3.5/6.0 W/m*K.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | H-PUTTY |
| Product Name | Thermal Conductive Putty |
| Chemical System | Silicone |
| Features | Thermally Conductive; UL Rating |
| Industry | Electronics |
