Non-Silicone Thermal Compound N800A is made of non-silicon resin material and none low-molecular-weight
Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight
| Shiu Li Technology Co., Ltd | Shiu Li Technology Co., Ltd | |
|---|---|---|
| Product Category | Industrial Sealants | Industrial Sealants |
| Product Number | N800B | N800B |
| Product Name | Non-Silicone Thermal Conductive Pad | Non-Silicone Thermal Conductive Pad |
| Type / Form | Sheet or Film | Sheet or Film |
| Features | Thermally Conductive | Thermally Conductive |
| Industry | Electronics | Electronics |
| Gap Fill | 0.0197 to 0.1969 inch (0.5000 to 5 mm) | 0.0197 to 0.1969 inch (0.5000 to 5 mm) |