Shiu Li Technology Co., Ltd Exceptionally Soft Thermal Conductive Gel Pad BS75K

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Exceptionally Soft Thermal Conductive Gel Pad - BS75K - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Exceptionally Soft Thermal Conductive Gel Pad BS75K
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications. BS75K is also UL 94V-0 approvedand REACH and RoHS compliant.

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications. BS75K is also UL 94V-0 approvedand REACH and RoHS compliant.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number BS75K
Product Name Exceptionally Soft Thermal Conductive Gel Pad
Industry Electronics
Use Temperature -76 to 356 F (-60 to 180 C)
Dielectric Strength 203 kV/in (80 kV/cm)
Chemical System Silicone
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