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Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications. BS75K is also UL 94V-0 approvedand REACH and RoHS compliant.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | BS75K |
| Product Name | Exceptionally Soft Thermal Conductive Gel Pad |
| Industry | Electronics |
| Use Temperature | -76 to 356 F (-60 to 180 C) |
| Dielectric Strength | 203 kV/in (80 kV/cm) |
| Chemical System | Silicone |
