LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications. BS75K is also UL 94V-0 approved and REACH and RoHS compliant.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | BS75K |
| Product Name | Exceptionally Soft Thermal Conductive Gel Pad |
| Type / Form | Sheet or Film |
| Chemical System | Silicone |
| Features | Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating |
| Industry | Electronics |
