LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications. BS75K is also UL 94V-0 approvedand REACH and RoHS compliant.
|Shiu Li Technology Co., Ltd|
|Product Category||Industrial Sealants|
|Product Name||Exceptionally Soft Thermal Conductive Gel Pad|
|Use Temperature||-76 to 356 F (-60 to 180 C)|
|Dielectric Strength||203 kV/in (80 kV/cm)|