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Shiu Li Technology Co., Ltd Thermal Conductive Die Attach Adhesive TIM12

Description
LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.
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Thermal Conductive Die Attach Adhesive - TIM12 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Thermal Conductive Die Attach Adhesive
TIM12
Thermal Conductive Die Attach Adhesive TIM12
LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.

LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s excellent TIM 1 Material with Thermal conductivity 2.0- 4.0W/m*K. Ideally suitable for automated dispensing operations.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Adhesives
Product Number TIM12
Product Name Thermal Conductive Die Attach Adhesive
Cure / Technology Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
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