Shiu Li Technology Co., Ltd Low-density Thermal Conductive Potting Compound TPS32

Description
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
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Low-density Thermal Conductive Potting Compound - TPS32 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Low-density Thermal Conductive Potting Compound
TPS32
Low-density Thermal Conductive Potting Compound TPS32
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.

LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.

Supplier's Site Datasheet

Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number TPS32
Product Name Low-density Thermal Conductive Potting Compound
Cure / Technology Room Temperature Vulcanizing or Curing
Type / Form Grease, Paste; Liquid
Chemical System Silicone
Features Encapsulant, Potting Compound; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
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