Shiu Li Technology Co., Ltd Datasheets for Industrial Greases

Industrial greases are thickened gels that consist of natural, synthetic, or semi-synthetic substances. They do not run off surfaces and are used in a variety of lubrication, sealing, and exclusion applications.
Industrial Greases: Learn more

Product Name Notes
LiPOLY D2000 is a two-part curable thermal grease. Fast curing at both room and high temperature without pumping effect. With a thermal conductivity of 2.0 W/m*K, D2000 provides high thermal...
LiPOLY DTT13 is a one-part dispensable material with thermal conductivity 13.0 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying...
LiPOLY G3380 thermal interface grease has low thermal resistance and great thermal conductivity. G3380 has been used extensively in Consumer electronics and Microprocessors for their thermal control techniques. The grease...
LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally...
LiPOLY N-putty3-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 7.0 W/m*K, the high deformation...
LiPOLY N-putty5-s series is a non-silicon thermally conductive material without volatilization of lowmolecular siloxane, and low total volatile gas. With a thermal conductivity of 9.0 W/m*K, the highdeformation can perfectly...
LiPOLY PK223DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 2.0 W/m*K, PK223DM provides high thermal conductivity and low...
LiPOLY PK404DM is a two-pack liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K, PK404DM provides high thermal conductivity and low...
LiPOLY PK605DM is a two-pack liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 5.0 W/m*K, PK605DM provides high thermal conductivity and low...
LiPOLY PK700DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 7.0 W/m*K, PK700DM provides high thermal conductivity and low...
LiPOLY TPS586/5868 is a two-part sealing gap filler, provides low viscosity and high fluidity. The high deformation material, which can filling the gap closely, cover the tolerance, and has outstanding...
LiPOLY TPS589 is a two-part sealing gap filler, provides low viscosity and high fluidity. The high deformation material, which can be filling the gap closely, cover the tolerance, and has...
LiPOLY TT3000 is a Nano type thermal interface material based on a unique formula. TT3000 is a highly reliable thermal grease made of Non-Solvent silicone oil compounds and thermal fillers.
LiPOLY's DTT04-s is a low-density gap filler material and lightweight properties improve product performance, reduceproduction costs, and reduce material use and energy consumption
LiPOLY's DTT06-s is a low-density gap filler material and lightweight properties improve product performance, reduceproduction costs, and reduce material use and energy consumption
LiPOLY's DTT10-s is a low-density gap filler material and lightweight properties improve product performance, reduceproduction costs, and reduce material use and energy consumption
Non-Silicone Thermal Compound G3380N is made of non-silicon resin material and pollution of optical surfaces. Low thermal resistance and great thermal conductivity. G3380N has been used extensively in Consumer electronics...
Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can...
Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material...