LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
| Shiu Li Technology Co., Ltd | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | T-top99-s |
| Product Name | High Thermal Conductive Pad |
| Type / Form | Sheet or Film |
| Chemical System | Silicone |
| Features | High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling |
