Shiu Li Technology Co., Ltd Exceptionally Soft Thermal Conductive Gel Pad BS89

Description
LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.
Datasheet
Description
LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Exceptionally Soft Thermal Conductive Gel Pad - BS89 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Exceptionally Soft Thermal Conductive Gel Pad
BS89
Exceptionally Soft Thermal Conductive Gel Pad BS89
LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.

LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.

Supplier's Site Datasheet

Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number BS89
Product Name Exceptionally Soft Thermal Conductive Gel Pad
Type / Form Sheet or Film
Chemical System Silicone
Features Thermally Conductive; UL Rating
Industry Electronics
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