Shiu Li Technology Co., Ltd Exceptionally Soft Thermal Conductive Gel Pad BS89

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Exceptionally Soft Thermal Conductive Gel Pad - BS89 - Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Exceptionally Soft Thermal Conductive Gel Pad BS89
LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.

LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide range of applications.

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Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number BS89
Product Name Exceptionally Soft Thermal Conductive Gel Pad
Industry Electronics
Use Temperature -76 to 356 F (-60 to 180 C)
Dielectric Strength 203 kV/in (80 kV/cm)
Chemical System Silicone
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