Shiu Li Technology Co., Ltd Non-Silicone Thermal Conductive Pad N700C

Description
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. It is suitable for optical and sensitive electric components.
  • Non-Silicone Thermal Conductive Pad - N700C - Shiu Li Technology Co., Ltd
    Shiu Li Technology Co., Ltd
Datasheet
Description
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. It is suitable for optical and sensitive electric components.
Datasheet

Suppliers

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Non-Silicone Thermal Conductive Pad - N700C - Shiu Li Technology Co., Ltd
Shiu Li Technology Co., Ltd
Taoyuan City, Taiwan
Non-Silicone Thermal Conductive Pad
N700C
Non-Silicone Thermal Conductive Pad N700C
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. It is suitable for optical and sensitive electric components.

Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. It is suitable for optical and sensitive electric components.

Supplier's Site Datasheet

Technical Specifications

  Shiu Li Technology Co., Ltd
Product Category Industrial Sealants
Product Number N700C
Product Name Non-Silicone Thermal Conductive Pad
Type / Form Sheet or Film
Features Thermally Conductive
Industry Electronics
Gap Fill 0.0197 to 0.1969 inch (0.5000 to 5 mm)
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