Epoxy Technology Datasheets for Epoxy Adhesives

Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Epoxy Adhesives: Learn more

Product Name Notes
Black, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
Fast UV Cure Epoxy -- EPO-TEK® OG146-178 A fast UV cure epoxy with low viscosity.
Optical Epoxy -- EPO-TEK® OM125 A room temperature curing fiber optic grade epoxy. It was designed for Telecordia 1221 applications of fiber optics and is also ideal for eliminating cracking of the glass core in...
Single Component, Silver-Filled Epoxy -- EPO-TEK® ED1021 A silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very...
Thermally Conductive Epoxy -- EPO-TEK® H61 Unfilled A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO-TEK® H61.
Single Component, UV Curable Epoxy -- EPO-TEK® OG146-104 A single component, UV curable epoxy designed for adhesive, coating and encapsulating applications within the semiconductor, fiber optic and medical industries. It can be used with fiber packaging, LCD, displays,...
Two Component, Low Temperature Curing, Nano Rubber Toughened Epoxy -- EPO-TEK® OD2003-LH Premium A two component, low temperature curing, nano rubber toughened epoxy. It has very good adhesion on metals and other substrates, excellent shear strength and vibration dampening properties. This is a...
Two Component, Low Temperature Curing, Nano Rubber Toughened Epoxy -- EPO-TEK® OD2003 A two component, low temperature curing, nano rubber toughened epoxy. It has very good adhesion on metals and other substrates, excellent shear strength and vibration resistance.
Two Component, Room Temperature Curing, General And Structural Grade Epoxy -- EPO-TEK® 730 Unfilled Black A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in filtration, opto-electronics, and PCB industries. It is a...
General Purpose Epoxy -- EPO-TEK® 730 Unfilled A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices.
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H21 A two component, silver-filled, electrically conductive epoxy designed for hybrid micro-electronic packaging and assemblies. It can be used for die-attach or SMD attach onto ceramic substrates as well as package...
High Temperature Epoxy -- EPO-TEK® 353ND BLACK EPO TEK® 353ND Black is a high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications.
High Temperature, Thixotropic Epoxy -- EPO-TEK® 353ND-T EPO TEK® 353ND-T is a highly thixotropic epoxy with non-flowing properties and high temperature resistance.
High Temperature Epoxy -- EPO-TEK® 377 EPO TEK® 377 is a high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor and optical applications.
Biocompatible, High Temperature, Black Epoxy -- EPO-TEK® MED-353ND Black EPO TEK® EPO-TEK® MED-353ND Black is a biocompatible, black, high Tg, high strength, high temperature epoxy, based on our well known EPO-TEK® 353ND adhesive. It was formulated for use in...
Silver-filled Epoxy System -- EPO-TEK® H20E-LC EPO TEK® H20E-LC is a silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its...
Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S EPO TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flow able consistency,...
Electrically Conductive Epoxy -- EPO-TEK® H20E-FC EPO-TEK ® H20E-FC is an electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. EPO-TEK® H20E-FC Advantages & Application Notes: It is...
Electrically Conductive, Silver Epoxy for Die Stamping -- EPO-TEK® H20S EPO-TEK H20S is a modified version of EPO-TEK H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, silver-filled epoxy with a...
Optically Transparent Epoxy -- EPO-TEK® 301-2 EPO-TEK® 301-2 is an optical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.
Optically Transparent Epoxy -- EPO-TEK® 301-2FL EPO-TEK® 301-2FL is an optical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.
Spectrally Transparent Epoxy -- EPO-TEK® 305 EPO-TEK® 305 is a semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, and optoelectronics. It is an electrically and thermally insulating epoxy.
Optical, Opaque Epoxy -- EPO-TEK® 320 EPO-TEK® 320 is a black-colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.
Optical Epoxy -- EPO-TEK® 323LP EPO-TEK® 323LP is a longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, and hard-disk drive applications.
Slightly Longer Life High Temperature Epoxy -- EPO-TEK® 323LP-LH Premium EPO-TEK® 323LP-LH Premium is a longer pot life version of EPO-TEK®353ND designed for semiconductor, hybrid, fiber-optic, and hard-disk drive applications. This product meets halogen-free requirements.
Slightly Longer Life High Temperature Epoxy -- EPO-TEK® 323LP-LH Ultra EPO-TEK® 323LP-LH Ultra is a longer pot life version of EPO-TEK®353ND designed for semiconductor, hybrid, fiber-optic, and hard-disk drive applications. This product easily meets halogen-free requirements.
Low Viscosity, Optical Epoxy -- EPO-TEK® 330 EPO-TEK® 330 is a high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, and fiber optics applications.
High Temperature Epoxy -- EPO-TEK® 353ND EPO-TEK® 353ND is a high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications. It is one of the most popular EPO-TEK® brand products, and is known throughout the...
High Temperature Epoxy -- EPO-TEK® 353ND-LH Premium EPO-TEK® 353ND-LH Premium is a high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications. This product meets halogen-free requirements.
Slightly Longer Life High Temperature Epoxy -- EPO-TEK® 353ND-LH Ultra EPO-TEK® 353ND-LH Ultra is a high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications. This product easily meets halogen-free requirements.
High Temperature, Thixotropic Epoxy -- EPO-TEK® 353ND-T BLACK EPO-TEK® 353ND-T BLACK is a high temperature, thixotropic epoxy for fiber optic, and PCB applications. It can be used for applications needing non-flow due to capillary action or gravity, as...
Thixotropic And High Temperature Epoxy -- EPO-TEK® 353ND-T1 EPO-TEK® 353ND-T1 is a thixotropic and high temperature epoxy designed for fiber optic, and electronics applications. It is a more viscous alternative to EPO-TEK® 353ND-T.
Thixotropic Epoxy -- EPO-TEK® 353ND-T4 EPO-TEK® 353ND-T4 is a high temperature, thixotropic epoxy designed for high temperature applications in fiber optics, and electronics.
High Temperature Thixotropic Epoxy -- EPO-TEK® 353ND-T5 EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T It was designed for high temperature applications in fiber optics, and electronics.
High Temperature Epoxy -- EPO-TEK® 354 EPO-TEK® 354 is a high Tg epoxy designed for semiconductor packaging in fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.
Thixotropic, High Tg Epoxy -- EPO-TEK® 354-T EPO-TEK® 354-T ia a thixotropic, high Tg epoxy designed for semiconductor packaging in fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic...
Low Viscosity Optical Epoxy Adhesive -- EPO-TEK® 360 EPO-TEK® 360 is a high-temperature grade epoxy for semiconductor, electronics, and fiber optics applications.
High-Temperature Grade, Electrically And Thermally Insulating Epoxy -- EPO-TEK® 360-ST EPO-TEK® 360-ST is a general type, insulative conductivity, oven, snap cure method
High-Temperature Grade, Electrically And Thermally Insulating Epoxy -- EPO-TEK® 360-T EPO-TEK® 360-T is a general type, insulative conductivity, oven, snap cure method
High Temperature Epoxy -- EPO-TEK® 375 EPO-TEK® 375 is a heat curing epoxy designed for high temperature fiber optic applications.
Graphite-Filled, High Temperature Epoxy -- EPO-TEK® 377H EPO-TEK® 377H is a high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and...
Longer Life High Temperature Epoxy -- EPO-TEK® 383ND EPO-TEK® 383ND is a slightly longer pot life version of EPO-TEK® 353ND
Slightly Longer Life High Temperature Epoxy -- EPO-TEK® 383ND-LH Premium EPO-TEK® 383ND-LH Premium is a slightly longer pot-life version of EPO-TEK® 353ND. This product meets halogen-free requirements.
Slightly Longer Life High Temperature Epoxy -- EPO-TEK® 383ND-LH Ultra EPO-TEK® 383ND-LH Ultra is a slightly longer pot-life version of EPO-TEK® 353ND. This product easily meets halogen-free requirements.
Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 430 EPO-TEK® 430 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding.
Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 431 EPO-TEK® 431 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding.
General Purpose Epoxy -- EPO-TEK® 509FM-1 EPO-TEK® 509FM-1 is an optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, and optical/OEM.
General Purpose Epoxy -- EPO-TEK® 730 EPO-TEK® 730 is a thixotropic, room temperature-curing epoxy adhesive.
Thixotropic, Room Temperature-Curing Epoxy Adhesive -- EPO-TEK® 731 EPO-TEK® 731 is a thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor packaging, electronics, and optical industries. A higher...
High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 920 EPO-TEK® 920 is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive...
Thermally Conductive Epoxy -- EPO-TEK® 920-FL EPO-TEK® 920-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity...
High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 921 EPO-TEK® 921 is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive...
High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 921-FL EPO-TEK® 921-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive...
Thermally Conductive Epoxy -- EPO-TEK® 930 EPO-TEK® 930 is a thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® 930-1 EPO-TEK® 930-1 is a thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics. It is a lower viscosity and smaller particle...
Thermally Conductive Epoxy -- EPO-TEK® 930-4 EPO-TEK® 930-4 is a thermally conductive epoxy, formulated with a very fine boron-nitride filler particle.
Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® B9126-7 EPO-TEK® B9126-7 is a thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing...
Thermally And Electrically Conductive Epoxy -- EPO-TEK® B9126-8 EPO-TEK® B9126-8 is a thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a one month pot-life, low temperature cure,...
High Temperature Epoxy -- EPO-TEK® CF6-2 EPO-TEK® CF6-2 is a high temperature and high Tg epoxy designed for fiber optic packaging.
Slightly Flexible, Silver-filled, Electrically Conductive Adhesive -- EPO-TEK® E2036 EPO-TEK® E2036 is a slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB...
Electrically Conductive Adhesive -- EPO-TEK® E3035 EPO-TEK® E3035 is a thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and...
Electrically Conductive, Thixotropic Silver-filled Epoxy -- EPO-TEK® E3037 EPO-TEK® E3037 is a electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.
Electrically Conductive, Silver Epoxy -- EPO-TEK® E4110 EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This epoxy is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
Electrically Conductive, Silver Epoxy -- EPO-TEK® E4110-LV EPO-TEK® E4110-LV is a silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110.
Electrically Conductive Epoxy -- EPO-TEK® E4110-PFC EPO-TEK® E4110-PFC is a silver-filled thixotropic epoxy for fine pitch applications in semiconductor flip chip or SMD microelectronic assemblies. Screen-printed "bumps" of EPO-TEK® E4110-PFC can be the size of 80...
Silver-Filled Epoxy -- EPO-TEK® ED1020 EPO-TEK® ED1020 is a silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes...
Silver-Filled, B-Stageable Epoxy -- EPO-TEK® EE149-6 EPO-TEK® EE149-6 is a silver-filled, B-stage able epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.
Electrically Conductive Epoxy -- EPO-TEK® EJ2189 EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV EPO-TEK® EJ2189-LV is a low viscosity, room temperature curing conductive epoxy.
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000-MP
EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED...
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK2000 EPO-TEK® EK2000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED...
Electrically Conductive Epoxy -- EPO-TEK® EM127 EPO-TEK® EM127 is a silver-filled epoxy, designed especially for semiconductor LED die attach. It has a shiny silver, metallic looking appearance which aids in the LED overall brightness. Some other...
Silver-filled, Electrically Conductive Epoxy -- EPO-TEK® EV2118-2 EPO-TEK® EV2118-2 is a silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
Single Component, Thixotropic, Electrically And Thermally Insulating Epoxy Adhesive -- EPO-TEK® GE116 EPO-TEK® GE116 is a thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer...
Single Component, Thixotropic, Electrically And Thermally Insulating Epoxy -- EPO-TEK® GE120 EPO-TEK® GE120 is a thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer...
Electrically Conductive, Silver Epoxy -- EPO-TEK® H20E EPO-TEK® H20E is a 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to...
Epoxy Designed For Semiconductor Die-attach -- EPO-TEK® H20E-175 EPO-TEK® H20E-175 is an epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic...
Silver-filled Epoxy System -- EPO-TEK® H20E-8 EPO-TEK® H20E-8 is a silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
Silver-Filled Epoxy With A Smooth Thixotropic Consistency -- EPO-TEK® H20E-D EPO-TEK® H20E-D is a silver-filled epoxy with a smooth thixotropic consistency. It is a version of EPO-TEK® H20E designed primarily for enhanced dispensability.
Silver-filled Epoxy System -- EPO-TEK® H20E-HC EPO-TEK® H20E-HC is a silver-filled, electrically and thermally conductive epoxy, designed for semiconductor die-attach and hybrid microelectronic packaging. It can be used for heat sinking, plastic IC packaging in JEDEC...
Electrically Conductive, Silver Epoxy -- EPO-TEK® H20E-LV EPO-TEK® H20E-LV is a 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach...
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20E-PFC EPO-TEK® H20E-PFC is a semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR EPO-TEK® H20E-SLR is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-HV EPO-TEK® H20E-SLR-HV is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-HVMX EPO-TEK® H20E-SLR-HVMX is an electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-MX EPO-TEK® H20E-SLR-MX is an electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing...
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20F EPO-TEK® H20F is a flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate...
Silver-Filled Epoxy With A Smooth, Thixotropic Consistency -- EPO-TEK® H20S-D EPO-TEK® H20S-D is a silver-filled epoxy with a smooth, thixotropic consistency. It is a version of EPO-TEK H20S designed primarily for enhanced dispensing.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H21D EPO-TEK® H21D is a high Tg, silver-filled epoxy adhesive designed for chip bonding in microelectronic and optoelectronic applications.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H22 EPO-TEK® H22 is a silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
Electrically Conductive Epoxy -- EPO-TEK® H24 EPO-TEK® H24 is an electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H27D EPO-TEK® H27D is a silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H31 EPO-TEK® H31 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H31D EPO-TEK® H31D is an electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC's, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H31LV EPO-TEK® H31LV is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H35-175MP EPO-TEK® H35-175MP is a silver-filled epoxy for military hybrid die and component attach.
Thermally and Electrically Conductive Epoxy -- EPO-TEK® H35-175MPLV EPO-TEK® H35-175MPLV is a silver-filled epoxy for military hybrid die and component attach. It is a lower viscosity version of EPO-TEK® H35-175MP.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H35-175MPT EPO-TEK® H35-175MPT is a silver-filled epoxy for military hybrid die and component attach.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H37-MP EPO-TEK® H37-MP is an electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages.
Silver-filled And Electrically Conductive Adhesive -- EPO-TEK® H37-MPT EPO-TEK® H37-MPT is a silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements...
Gold-Filled, Electrically Conductive Epoxy -- EPO-TEK® H44 EPO-TEK® H44 is a gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.
High Temperature Epoxy -- EPO-TEK® H54 EPO-TEK® H54 is a high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in hybrid, and optical industries.
Thixotropic And High Temperature Epoxy -- EPO-TEK® H55 EPO-TEK® H55 is a thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.
Thermally Conductive Epoxy -- EPO-TEK® H61 EPO-TEK® H61 is a thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
Thixotropic And High Temperature Epoxy -- EPO-TEK® H61LV EPO-TEK® H61LV is a high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61.
Thixotropic And High Temperature Epoxy -- EPO-TEK® H61ND EPO-TEK® H61ND is a high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.
Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® H63 EPO-TEK® H63 is an electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK® H62.
Thermally Conductive Epoxy -- EPO-TEK® H67-MP EPO-TEK® H67-MP is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,...
Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® H70E-1 EPO-TEK® H70E-1 is a thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications.
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2LC EPO-TEK® H70E-2LC is a thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged...
Thermally Conductive Epoxy -- EPO-TEK® H73 EPO-TEK® H73 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74.
Thermally Conductive Epoxy -- EPO-TEK® H74 EPO-TEK® H74 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74.
High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74F EPO-TEK® H74F is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip...
High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H75 EPO-TEK® H75 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity...
Thermally Conductive Epoxy -- EPO-TEK® H77 Black EPO-TEK® H77 Black is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar.
Thermally Conductive, Electrically Insulating High-Temperature Epoxy Adhesive -- EPO-TEK® H77S EPO-TEK® H77S is a thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and under fill, hybrid microelectronics,...
Thermally Conductive Epoxy -- EPO-TEK® H77T EPO-TEK® H77T is a thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging, hybrid microelectronics, and optical. It is a more...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND EPO-TEK® HYB-353ND is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-HV EPO-TEK® HYB-353ND-HV is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-LV EPO-TEK® HYB-353ND-LV is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-TX2 EPO-TEK® HYB-353ND-TX2 is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-TX3 EPO-TEK® HYB-353ND-TX3 is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
B-Stageable Epoxy Paste -- EPO-TEK® M10-D EPO-TEK® M10-D is a B-stage able epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. In opto-packaging, it can...
B-Stageable, Optical Grade Epoxy -- EPO-TEK® MA-5 EPO-TEK® MA-5 is a B-stage able, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed-through into...
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301 EPO-TEK® MED-301 is a Certified ISO 10993, biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are self-leveling, short pot-life, and ease of application, either by dispensing...
Biocompatible, Optically Transparent Epoxy -- EPO-TEK® MED-301-2 EPO-TEK® MED-301-2 is a Certified ISO 10993, biocompatible, clear and colorless, low viscosity, long pot-life, room temperature curing epoxy. Additional characteristics are: • Ease of use in potting and casting...
Biocompatible, Low Stress, Optical Epoxy -- EPO-TEK® MED-301-2FL EPO-TEK® MED-301-2FL is a biocompatible, low temperature curing, low stress and more flexible version of EPO-TEK® MED-301-2. It is used in fiber optic applications as well as potting, casting and...
Biocompatible, Optically Opaque Epoxy -- EPO-TEK® MED-302-3M Black EPO-TEK® MED-302-3M Black is a Certified ISO 10993, biocompatible, black, opaque, medium viscosity epoxy. Additional characteristics are: high moisture and chemical resistance and is capable of low temperature curing. It...
Biocompatible, Optically Transparent Epoxy -- EPO-TEK® MED-302-3M EPO-TEK® MED-302-3M is a Certified ISO 10993, biocompatible, clear and colorless, low viscosity epoxy, with high moisture and chemical resistance and is room temperature curing. Additional characteristics are: • Can...
Biocompatible, Opaque Epoxy -- EPO-TEK® MED-320 EPO-TEK® MED-320 is a Certified ISO 10993, black, biocompatible, thixotropic, low temperature curing, optically opaque epoxy for fiber optics, camera and photonic packaging, often used in bonding/potting/sealing of optics used...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-323LP EPO-TEK® MED-323LP is a biocompatible, high strength, high temperature, high Tg, long pot-life epoxy. It is used in many medical applications for adhesive, potting, sealing and encapsulation, especially suited for...
Biocompatible, High Temperature Epoxy -- EPO-TEK® MED-353ND EPO-TEK® MED-353ND is a Certified ISO 10993, biocompatible, high temperature, high Tg, and high strength epoxy. It has decades of use and reliability in medical device designs worldwide. Medical applications...
Biocompatible, High Temperature Thixotropic Epoxy -- EPO-TEK® MED-353ND-T EPO-TEK® MED-353ND-T is a Certified ISO 10993, biocompatible, thixotropic formulated version of EPO-TEK® MED-353ND. It has non-flowing properties (paste/non-sagging) and high temperature resistance. Some additional characteristics are: • Built-in color...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-354 EPO-TEK® MED-354 is a Certified ISO 10993, biocompatible, high Tg, medium viscosity epoxy with a very long (three days) pot life used in many medical applications, especially fiber optic endoscopy.
Biocompatible, Thixotropic Epoxy -- EPO-TEK® MED-354-T EPO-TEK® MED-354-t is a Certified ISO 10993, biocompatible, high Tg, thixotropic version of EPO-TEK® MED-354 epoxy. It is electrically and thermally insulating and formulated for medical applications with fiber optics,...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-375 EPO-TEK® MED-375 is a Certified ISO 10993, biocompatible, high Tg, high temperature epoxy. It has a color change upon cure and can provide near hermetic sealing. Additionally, it has excellent...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-377 EPO-TEK® MED-377 is a Certified ISO 10993, biocompatible, high Tg, high temperature epoxy. Due to its low viscosity, it is easy to use and can be applied easily by many...
Biocompatible, Electrically Conductive (ECA), Silver Epoxy -- EPO-TEK® MED-H20E EPO-TEK® MED-H20E is a Certified ISO 10993, biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of...
Biocompatible, Electrically Conductive, Silver Epoxy -- EPO-TEK® MED-H20S EPO-TEK® MED-H20S is a Certified ISO 10993, biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a smooth low viscosity paste with fine Ag particles. It is a...
Biocompatible, UV Hybrid Curing Epoxy -- EPO-TEK® MED-HYB-353ND EPO-TEK® MED-HYB-353ND is a biocompatible, high temperature specialty UV hybrid curing epoxy, formulated for process improvement (assembly) for photonic packaging. It has very high strength and moisture resistance.
Biocompatible, High Tg, Optical Epoxy -- EPO-TEK® MED-OD2002 EPO-TEK® MED-OD2002 is a Certified ISO 10993, biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistance and when cured...
Biocompatible, UV Curing Epoxy -- EPO-TEK® MED-OG116-31 EPO-TEK® MED-OG116-31 is a Certified ISO 10993, biocompatible, one component, thixotropic, high Tg, cationic/epoxy UV curing adhesive. With thermal post curing, this UV has very high chemical resistance and is...
Biocompatible, Shadow Curable Capable, UV Curing Epoxy -- EPO-TEK® MED-OG198-54 EPO-TEK® MED-OG198-54 is a Certified ISO 10993, biocompatible, clear, low viscosity, high Tg, high strength, cationic/epoxy UV curing adhesive. It has capillary wicking and is capable of reaching shadowed regions...
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110 EPO-TEK® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray,...
Electrically Insulative Epoxy -- EPO-TEK® OD1001 EPO-TEK® OD1001 is a thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few...
High Tg Optical Epoxy -- EPO-TEK® OD2002 EPO-TEK® OD2002 is a high Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364.
High Tg, High Temperature Grade Epoxy -- EPO-TEK® OE100T EPO-TEK® OE100T is a high Tg, high temperature grade epoxy designed for semiconductor, under fill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive...
Low Temperature Curing Epoxy Adhesive -- EPO-TEK® OE121-BLACK EPO-TEK® OE121-BLACK is an optical type, insulative conductivity, room cure method
Epoxy With Intermediate Viscosity Range -- EPO-TEK® OE138 EPO-TEK® OE138 is an epoxy with intermediate viscosity range between EPO-TEK®353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in fiber optic industries.
UV Cured, High Viscosity Adhesive -- EPO-TEK® OG116 EPO-TEK® OG116 is an UV cured, high viscosity adhesive for opto-electronic applications including fiber optic packaging, sensor device, SCI-OEM optics and general electronic assembly. Notable qualities include high Tg and...
UV Epoxy -- EPO-TEK® OG133-8 EPO-TEK® OG133-8 is an UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic...
UV Cure Optical Epoxy -- EPO-TEK® OG142 EPO-TEK® OG142 is an UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, and scientific/OEM industries. It is a high Tg epoxy, ideal...
UV Cure Optical Epoxy -- EPO-TEK® OG142-112 EPO-TEK® OG142-112 is a low viscosity epoxy for adhesive sealing and encapsulating fiber optic and opto-electronic packaging applications.
Low Viscosity, UV Curable Epoxy -- EPO-TEK® OG142-87 EPO-TEK® OG142-87 is a low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications. Replacement version of EPO-TEK OG142-13 with better bonding strength and...
Low Viscosity, UV Curable Epoxy -- EPO-TEK® OG142-95 EPO-TEK® OG142-95 is a low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications. Replacement version of EPO-TEK OG142-17 with better bonding strength and...
UV Curable Epoxy -- EPO-TEK® OG154-1 EPO-TEK® OG154-1 is a UV curable epoxy for adhesive sealing and encapsulating applications found in semiconductor, electro-optics, fiber optics, and scientific/OEM industries. Replacement for EPO-TEK OG154.
High Viscosity, UV Curable Epoxy Adhesive -- EPO-TEK® OG159-2 EPO-TEK® OG159-2 is a high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common...
UV/Visible Shifted Light Curable Epoxy -- EPO-TEK® OG178 EPO-TEK® OG178 is an UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, and scientific/OEM industries. It is a low...
UV Epoxy -- EPO-TEK® OG198-54 EPO-TEK® OG198-54 is a low viscosity, high Tg, UV curable epoxy. Active alignment of optics, securing fibers into V-grooves and fiber pigtails are a few of its common applications. It...
Shadow Curable UV Epoxy -- EPO-TEK® OG198-55 EPO-TEK® OG198-55 is a thixotropic, high Tg, UV curable epoxy. Active alignment of optics, securing fibers into V-grooves and fiber pigtails are a few of its common applications. It can...
Low Viscosity, UV Curable Adhesive -- EPO-TEK® OG603 EPO-TEK® OG603 is a low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, and PCB...
UV Curable Adhesive Designed for Glob Top Encapsulation -- EPO-TEK® OG653 EPO-TEK® OG653 is a UV curable adhesive designed for glob top encapsulation.
UV Fast Curing, Optically Clear Adhesive -- EPO-TEK® OG675 EPO-TEK® OG675 is a UV fast curing, optically clear adhesive offering compliance and high strength.
Electrically Conductive Modified Polyimide -- EPO-TEK® P1011 EPO-TEK® P-1011 is a modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.
Modified Polyimide, High-temperature Grade, Silver-filled,Electrically And Thermally Conductive Adhesive -- EPO-TEK® P10 EPO-TEK® P10 is a modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
Electrically Conductive Modified Polyimide -- EPO-TEK® P1011S EPO-TEK® P1011S is a modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. It is a lower viscosity version of EPO-TEK®
High Tg, Thermally Conductive, Semiconductor Die-Attach Grade Epoxy -- EPO-TEK® T6065 EPO-TEK® T6065 is a high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic...
Thermally Conductive And Electrically Insulating Epoxy -- EPO-TEK® T6067 EPO-TEK® T6067 is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,...
Thermally Conductive Epoxy -- EPO-TEK® T7109 EPO-TEK® T7109 is a thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, and optical industries.
Thermally Conductive, Room-Temperature Cure Epoxy -- EPO-TEK® T7110 EPO-TEK® T7110 is a thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such...
Glob Top Epoxy -- EPO-TEK® T7139 EPO-TEK® T7139 is an electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.
Thermally Conductive Epoxy -- EPO-TEK® T905BN-3 EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications.
Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ2183-LH EPO-TEK® TJ2183-LH is a low halogen, electrically insulating die attach adhesive with extended pot life.
Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TV2001 EPO-TEK® TV2001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of...
Thermally Conductive Epoxy -- EPO-TEK® TZ101 EPO-TEK® TZ101 is an electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an under fill for flip chip...
Clear, UV Curable Adhesive -- EPO-TEK® UJ1190 EPO-TEK® UJ1190 is a clear, UV curable adhesive.
Spectrally Transparent Epoxy -- EPO-TEK® 301 EPO-TEK® 301 is a room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK® 301 Advantages & Suggested Application Notes: • Semiconductor: optical glob top or under...
Room Temperature Curing, Optical Grade Epoxy -- EPO-TEK® 301-1 EPO-TEK® 301-1 is a room temperature curing, optical grade epoxy, designed for optics, and opto-electronic packaging of semiconductor devices, components, and electronics. It is a lower viscosity version of EPO-TEK®
Fast Setting, Optical Epoxy -- EPO-TEK® 302 EPO-TEK® 302 is a fast-gelling, room temperature curing epoxy, designed for electronic, optical, and general applications. EPO-TEK® 302 Advantages & Application Notes: • Due to its versatility, it may be...
Optically Transparent Epoxy -- EPO-TEK® 302-3M EPO-TEK® 302-3M is an epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. EPO-TEK® 302-3M Advantages &
Optically Transparent Epoxy Designed for REACH requirements -- EPO-TEK® 302-3M-R EPO-TEK® 302-3M-R is designed to meet European Regulatory Requirements. The epoxy is used for optical, fiber optic, and semiconductor applications and is good for adhesive joining, sealing, potting, or as...
Optically Transparent Epoxy -- EPO-TEK® 310M-1 EPO-TEK® 310M-1 is an optically clear epoxy adhesive designed for optical, and semiconductor applications.
Optically Clear, Flexible Epoxy Adhesive -- EPO-TEK® 310M-2 EPO-TEK® 310M-2 is an optically clear, flexible epoxy adhesive designed for optical applications within semiconductor, and fiber optic industries. An alternative to EPO-TEK® 310M
Optically Transparent Epoxy -- EPO-TEK® 310M EPO-TEK® 310MA flexible, optically clear epoxy adhesive designed for optical, and semiconductor applications.
Flexible Epoxy Designed For Low Stress Applications -- EPO-TEK® 310T-M EPO-TEK® 310T-M is a flexible epoxy designed for low stress applications in semiconductor, hybrid, acoustical and optical industries. Replacement for EPO-TEK® 310T.
High Temperature Grade, Thermally & Electrically Insulating Epoxy -- EPO-TEK® 314 EPO-TEK® 314 is a high temperature grade, thermally and electrically insulating epoxy, designed for adhesive and sealing applications found in semiconductor, electro-optics, fiber optics, and scientific/OEM industries. It is a...
Optically Opaque Epoxy Adhesive -- EPO-TEK® 320LV EPO-TEK® 320 LV is an optically opaque epoxy adhesive designed for semiconductor and PCB applications in optoelectronic instrumentation and assemblies. A lower viscosity version of EPO-TEK® 320 that can be...
Black-colored And Optically Opaque Epoxy -- EPO-TEK® 320-3 EPO-TEK® 320-3 is a black-colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical...
Black-colored And Optically Opaque Epoxy -- EPO-TEK® 320NC EPO-TEK® 320NC is a black-colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased insulation...
Black-colored And Optically Opaque Epoxy -- EPO-TEK® 320NC-2 EPO-TEK® 320NC-2 is a black colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased...
Electrically Conductive, Silver Epoxy -- EPO-TEK® E2001 EPO-TEK® E2001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E2001 Advantages & Application Notes: • This epoxy can offer advantages...
Electrically Conductive, Silver-Filled Epoxy -- EPO-TEK® E2001-HV EPO-TEK® E2001-HV Is a snap cure, silver-filled die attach adhesive for semiconductor plastic IC packaging. EPO-TEK® E2001-HV Advantages & Application Notes: • Snap cure adhesive or fast-cure; chips can be...
Electrically Conductive, Silver Epoxy -- EPO-TEK® E2101 EPO-TEK® E2101 is a thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. EPO-TEK® E2101 Advantages & Application Notes: • Thixotropic paste allows for application...
Electrically Conductive, Silver Epoxy -- EPO-TEK® E3001
Electrically Conductive, Silver-Filled Epoxy -- EPO-TEK® E3001-6
EPO-TEK® E3001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E3001 Advantages & Application Notes: • Versatility & Cure: snap cures...
Electrically Conductive, Silver Epoxy -- EPO-TEK® E3001-HV EPO-TEK® E3001-HV is a silver-filled die attach adhesive for semiconductor plastic IC packaging. EPO-TEK® E3001-HV Advantages & Application Notes: • Snap cure adhesive or fast-cure; chips can be cured in-line...
Electrically Conductive Epoxy -- EPO-TEK® H20E-MP EPO-TEK® H20E-MP is a 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to...
Thermally Conductive Epoxy -- EPO-TEK® H62 EPO-TEK® H62 is an electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits. EPO-TEK® H62 Advantages & Application Notes: • Black...
Thermally Conductive Epoxy -- EPO-TEK® H65-175MP EPO-TEK® H65-175MP is an alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. EPO-TEK® H65-175MP Advantages...
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E EPO-TEK® H70E is a thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. EPO-TEK® H70E Advantages & Application Notes: - Heat-sinking adhesive. It is particularly...
Thermally Conductive Epoxy -- EPO-TEK® H70E-175 EPO-TEK® H70E-175 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of...
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2 EPO-TEK® H70E-2 is a thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged...
Thermally Conductive Epoxy -- EPO-TEK® H70E-4 EPO-TEK® H70E-4 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid...
Thermally Conductive Epoxy -- EPO-TEK® H72 EPO-TEK® H72 is a high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. EPO-TEK® H72 Advantages & Application Notes:...
Thermally Conductive Epoxy -- EPO-TEK® H77 EPO-TEK® H77 is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package...
Gold-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® H81 EPO-TEK® H81 is a gold-filled, electrically and thermally conductive epoxy designed for hybrid micro-electronic and semiconductor packaging. EPO-TEK® H81 Advantages & Application Notes: - Gold filled epoxy allows for anti-oxidation...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-302-3M-R EPO-TEK® MED-302-3M-R is a biocompatible, clear and colorless, low viscosity epoxy designed to meet European Regulatory requirements. It has high moisture and chemical resistance and is room temperature curing. Additional...
Electrically Conductive Paste -- EPO-TEK® N20E EPO-TEK® N20E is an electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries. EPO-TEK®
High Temperature, Low CTE Epoxy -- EPO-TEK® OE188 EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. EPO-TEK® OE188 Advantages & Application Notes: • Paste-like viscosity allows for application by dispensing, or hand methods...
UV Cure Optical Epoxy -- EPO-TEK® OG116-31 EPO-TEK® OG116-31 is an UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries. EPO-TEK® OG116-31 Advantages & Application Notes:...
Thermally Conductive Epoxy -- EPO-TEK® T905BN-4 EPO-TEK® T905BN-4 is a room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications. EPO-TEK® T905BN-4 Advantages & Application Notes: A moderate viscosity resin with...
Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TD1001 EPO-TEK® TD1001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and...