EPO-TEK¬Æ H70S is a thermally conductive epoxy specifically designed for die stamping applications. This two-component epoxy features a mix ratio of 1:1 by weight and is recommended to cure at 150¬8C for one hour. It has a smooth, flowable consistency, making it suitable for chip bonding in micro-electronic and opto-electronic applications. The product exhibits a thermal conductivity of 0.4 W/mK and a volume resistivity of ,â 7 x 10^13 Ohm-cm, ensuring effective thermal management while remaining electrically insulating. The epoxy has a pot life of three days and a shelf life of one year at room temperature. It can be cured rapidly, making it ideal for quick circuit repairs and in-line semiconductor die-bonding. EPO-TEK¬Æ H70S demonstrates excellent adhesion to various substrates, including ferrous and non-ferrous metals, glass, ceramics, and PCBs. It is also suitable for potting applications due to its easy flow and pouring characteristics. The product meets JEDEC Level III and II packaging criteria, making it a reliable choice for demanding applications in industries such as aerospace, automotive, and electronics.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® H70S |
| Product Name | Thermally Conductive Epoxy for Die Stamping |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Composition | Filled |
| Features | Encapsulant, Potting Compound; Thermally Conductive |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
