EPO-TEK¬Æ T7110 is a two-component, thermally conductive epoxy designed for applications requiring heat sinking in electronics and semiconductors. It features a mix ratio of 10:1 by weight and offers a pot life of 3.5 hours at room temperature. The recommended cure condition is 80¬8C for 2 hours, although alternative curing options are available at lower temperatures, which may affect performance properties. The epoxy has a specific gravity of 2.28 for Part A and 0.92 for Part B, and it exhibits a low viscosity of 1,400 to 2,200 cPs at 23¬8C, allowing for bubble-free potting and encapsulation. It is characterized by a thermal conductivity of 1.0 W/mK and a volume resistivity of ,â 2 x 10^13 Ohm-cm, making it electrically insulating. The product has a glass transition temperature of ,â 40¬8C and a suggested operating temperature of less than 250¬8C for intermittent use. EPO-TEK¬Æ T7110 is suitable for various applications, including semiconductor packaging, heat sinking, and potting of electronic components. It is particularly advantageous for temperature-sensitive devices due to its low exothermic chemistry during polymerization. The product is also noted for its durability in hostile environments, making it a viable option for industries such as aerospace, automotive, and medical.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® T7110 |
| Product Name | Thermally Conductive, Room-Temperature Cure Epoxy |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Chemical System | Epoxy |
| Features | High Dielectric; Encapsulant, Potting Compound; Thermally Conductive |
| Substrate Compatibility | Metal; Plastic |
| Industry | Electronics; Sanitary; Optical; Photonics; Semiconductors, IC's |
