EPO-TEK¬Æ H54 is a two-component high-temperature epoxy adhesive designed for applications requiring electrical and thermal insulation. It is suitable for general bonding and high-temperature packaging, particularly in hybrid and optical industries. The recommended cure condition is 150¬8C for one hour, with alternative curing options available at lower temperatures, though performance may vary. The product exhibits a thixotropic nature, allowing it to maintain its position without sagging prior to cure. It transitions in color from tan to amber upon curing, indicating successful application. EPO-TEK¬Æ H54 adheres well to a variety of substrates, including plastics, ceramics, metals, and glass, making it versatile for different bonding needs. Key physical properties include a viscosity range of 9,000 to 15,000 cPs at 23¬8C, a glass transition temperature of at least 90¬8C, and a Shore D hardness of 80. The adhesive demonstrates excellent lap shear strength of 1,953 psi at 23¬8C and can withstand degradation temperatures up to 399¬8C. It is recommended for use in applications such as staking SMD devices to PCBs and bonding ferrites for power devices. Engineers should consider EPO-TEK¬Æ H54 for projects that require reliable high-temperature performance and strong adhesion across various materials.
We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin for harvesting sunlight, while providing watertight protection. EPO-TEK®
They are commonly used in:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® H54 |
| Product Name | High Temperature Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Features | High Dielectric; Thermal Insulation |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
| Industry | Electronics; Optical; Photonics |
