EPO-TEK¬Æ 920-FL is a two-component thermally conductive epoxy designed for thermal management applications in semiconductor, hybrid microelectronics, PCB, and optical industries. It features a recommended cure temperature of 150¬8C for one hour, with alternative curing options available at lower temperatures. The epoxy has a mix ratio by weight of 100:3 and a pot life of seven hours at room temperature. The product exhibits a specific gravity of 2.52 for Part A and 1.02 for Part B, with a viscosity range of 8,000 to 12,000 cPs at 23¬8C. It has a glass transition temperature of at least 90¬8C and a thermal conductivity of 0.9 W/mK. The epoxy is electrically insulating, with a volume resistivity of at least 4 x 10^13 Ohm-cm and a dielectric constant of 5.96 at 1 kHz. EPO-TEK¬Æ 920-FL is suitable for various applications, including mounting heat sinks, potting connectors, and providing thermal management for semiconductor packages. It is characterized by its smooth, flowing paste consistency, which facilitates ease of use in potting and casting applications. The product is available in multiple viscosity ranges and has a shelf life of one year at room temperature.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® 920-FL |
| Product Name | Thermally Conductive Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Features | High Dielectric; Encapsulant, Potting Compound; Thermally Conductive |
| Substrate Compatibility | Metal; Plastic |
| Industry | Electronics; Photonics; Semiconductors, IC's |
