Epoxy Technology Datasheets for Thermosets and Thermoset Resins

Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Thermosets and Thermoset Resins: Learn more

Product Name Notes
Silver-Filled Epoxy -- EPO-TEK® ED1021 A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and...
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H21 A two component, silver-filled, electrically conductive epoxy designed for hybrid micro-electronic packaging and assemblies. It can be used for die-attach or SMD attach onto ceramic substrates as well as package...
High Temperature Epoxy -- EPO-TEK® 353ND BLACK EPO TEK® 353ND Black is a high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications.
High Temperature, Thixotropic Epoxy -- EPO-TEK® 353ND-T EPO TEK® 353ND-T is a highly thixotropic epoxy with non-flowing properties and high temperature resistance.
Biocompatible, High Temperature, Black Epoxy -- EPO-TEK® MED-353ND Black EPO TEK® EPO-TEKĀ® MED-353ND Black is a biocompatible, black, high Tg, high strength, high temperature epoxy, based on our well known EPO-TEKĀ® 353ND adhesive. It was formulated for use in...
Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® H70E-2 EPO TEK® H70E-2 is a thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically...
Electrically Conductive Epoxy -- EPO-TEK® EJ2189 EPO-TEK ® E J2189 is an electrically conductive, silver-filled epoxy paste. This epoxy is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
Electrically Conductive, Silver Epoxy for Die Stamping -- EPO-TEK® H20S EPO-TEK H20S is a modified version of EPO-TEK H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, silver-filled epoxy with a...
Room Temperature Curing, Optical Grade Epoxy -- EPO-TEK® 301-1 EPO-TEK® 301-1 is a room temperature curing, optical grade epoxy, designed for optics, and opto-electronic packaging of semiconductor devices, components, and electronics. It is a lower viscosity version of EPO-TEK®
Optically Transparent Epoxy -- EPO-TEK® 301-2 EPO-TEK® 301-2 is an optical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.
Optically Transparent Epoxy -- EPO-TEK® 301-2FL EPO-TEK® 301-2FL is an optical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.
Spectrally Transparent Epoxy -- EPO-TEK® 305 EPO-TEK® 305 is a semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, and optoelectronics. It is an electrically and thermally insulating epoxy.
Optically Transparent Epoxy -- EPO-TEK® 310T-M EPO-TEK® 310T-M is a flexible epoxy designed for low stress applications in semiconductor, hybrid, acoustical and optical industries. Replacement for EPO-TEK® 310T.
Optical, Opaque Epoxy -- EPO-TEK® 320 EPO-TEK® 320 is a black-colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.
Black-colored And Optically Opaque Epoxy -- EPO-TEK® 320-3 EPO-TEK® 320-3 is a black-colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical...
Black-colored And Optically Opaque Epoxy -- EPO-TEK® 320NC EPO-TEK® 320NC is a black-colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased insulation...
Black-colored And Optically Opaque Epoxy -- EPO-TEK® 320NC-2 EPO-TEK® 320NC-2 is a back colored and optically opaque epoxy designed for optical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased...
Optical Epoxy -- EPO-TEK® 323LP EPO-TEK® 323LP is a longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, and hard-disk drive applications.
Low Viscosity, Optical Epoxy -- EPO-TEK® 330 EPO-TEK® 330 is a high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, and fiber optics applications.
High Temperature Epoxy -- EPO-TEK® 353ND EPO-TEK® 353ND is a high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications. It is one of the most popular EPO-TEK® brand products, and is known throughout the...
High Temperature, Thixotropic Epoxy -- EPO-TEK® 353ND-T BLACK EPO-TEK® 353ND-T BLACK is a high temperature, thixotropic epoxy for fiber optic, and PCB applications. It can be used for applications needing non-flow due to capillary action or gravity, as...
Thixotropic And High Temperature Epoxy -- EPO-TEK® 353ND-T1 EPO-TEK® 353ND-T1 is a thixotropic and high temperature epoxy designed for fiber optic, and electronics applications. It is a more viscous alternative to EPO-TEK® 353ND-T.
Thixotropic Epoxy -- EPO-TEK® 353ND-T4 EPO-TEK® 353ND-T4 is a high temperature, thixotropic epoxy designed for high temperature applications in fiber optics, and electronics.
High Temperature Thixotropic Epoxy -- EPO-TEK® 353ND-T5 EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T It was designed for high temperature applications in fiber optics, and electronics.
High Temperature Epoxy -- EPO-TEK® 354 EPO-TEK® 354 is a high Tg epoxy designed for semiconductor packaging in fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.
Thixotropic, High Tg Epoxy -- EPO-TEK® 354-T EPO-TEK® 354-T is a thixotropic, high Tg epoxy designed for semiconductor packaging in fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic...
Low Viscosity Optical Epoxy Adhesive -- EPO-TEK® 360 EPO-TEK® 360 is a high-temperature grade epoxy for semiconductor, electronics, and fiber optics applications.
High-Temperature Grade, Electrically And Thermally Insulating Epoxy -- EPO-TEK® 360-ST EPO-TEK® 360-ST is a general type, insulative conductivity, oven, snap cure method
High-Temperature Grade, Electrically And Thermally Insulating Epoxy -- EPO-TEK® 360-T EPO-TEK® 360-T is a general type, insulative conductivity, oven, snap cure method
High Temperature Epoxy -- EPO-TEK® 375 EPO-TEK® 375 is a heat curing epoxy designed for high temperature fiber optic applications.
Graphite-Filled, High Temperature Epoxy -- EPO-TEK® 377H EPO-TEK® 377H is a high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and...
Longer Life High Temperature Epoxy -- EPO-TEK® 383ND EPO-TEK® 383ND is a slightly longer pot life version of EPO-TEK® 353ND
General Purpose Epoxy -- EPO-TEK® 509FM-1 EPO-TEK® 509FM-1 is an optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, and optical/OEM.
Thermally Conductive Epoxy -- EPO-TEK® 920-FL EPO-TEK® 920-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity...
Thermally Conductive Epoxy -- EPO-TEK® 930 EPO-TEK® 930 is a thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® 930-1 EPO-TEK® 930-1 is a thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics. It is a lower viscosity and smaller particle...
Thermally Conductive Epoxy -- EPO-TEK® 930-4 EPO-TEK® 930-4 is a thermally conductive epoxy, formulated with a very fine boron-nitride filler particle.
High Temperature Epoxy -- EPO-TEK® CF6-2 EPO-TEK® CF6-2 is a high temperature and high Tg epoxy designed for fiber optic packaging.
Electrically Conductive Adhesive -- EPO-TEK® E3035 EPO-TEK® E3035 is a thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and...
Electrically Conductive, Thixotropic Silver-filled Epoxy -- EPO-TEK® E3037 EPO-TEK® E3037 is an electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.
Electrically Conductive, Silver Epoxy -- EPO-TEK® E4110 EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This epoxy is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
Electrically Conductive, Silver Epoxy -- EPO-TEK® E4110-LV EPO-TEK® E4110-LV is a silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110.
Electrically Conductive Epoxy -- EPO-TEK® E4110-PFC EPO-TEK® E4110-PFC is a silver-filled thixotropic epoxy for fine pitch applications in semiconductor flip chip or SMD microelectronic assemblies. Screen-printed "bumps" of EPO-TEK® E4110-PFC can be the size of 80...
Silver-Filled Epoxy -- EPO-TEK® ED1020 EPO-TEK® ED1020 is a silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes...
Silver-Filled, B-Stageable Epoxy -- EPO-TEK® EE149-6 EPO-TEK® EE149-6 is a silver-filled, B-stage able epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.
Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV EPO-TEK® EJ2189-LV is a low viscosity, room temperature curing conductive epoxy.
Electrically Conductive Epoxy -- EPO-TEK® EM127 EPO-TEK® EM127 is a silver-filled epoxy, designed especially for semiconductor LED die attach. It has a shiny silver, metallic looking appearance which aids in the LED overall brightness. Some other...
Electrically Conductive Epoxy -- EPO-TEK® EV2118-2 EPO-TEK® EV2118-2 is a silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
Epoxy Designed For Semiconductor Die-attach -- EPO-TEK® H20E-175 EPO-TEK® H20E-175 is an epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic...
Silver-filled Epoxy System -- EPO-TEK® H20E-8 EPO-TEK® H20E-8 is a silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
Silver-filled Epoxy System -- EPO-TEK® H20E-HC EPO-TEK® H20E-HC is a silver-filled, electrically and thermally conductive epoxy, designed for semiconductor die-attach and hybrid microelectronic packaging. It can be used for heat sinking, plastic IC packaging in JEDEC...
Electrically Conductive, Silver Epoxy -- EPO-TEK® H20E-LV EPO-TEK® H20E-LV is 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach epoxy.
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20E-PFC EPO-TEK® H20E-PFC is a semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.
Electrically Conductive, Flexible Epoxy -- EPO-TEK® H20F EPO-TEK® H20F is a flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate...
Electrically Conductive, Silver Epoxy -- EPO-TEK® H22 EPO-TEK® H22 is a silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H31 EPO-TEK® H31 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H31D EPO-TEK® H31D is an electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC's, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H31LV EPO-TEK® H31LV is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H35-175MP EPO-TEK® H35-175MP is a silver-filled epoxy for military hybrid die and component attach.
Thermally and Electrically Conductive Epoxy -- EPO-TEK® H35-175MPLV EPO-TEK® H35-175MPLV is a silver-filled epoxy for military hybrid die and component attach. It is a lower viscosity version of EPO-TEK® H35-175MP.
Electrically Conductive, Silver Epoxy -- EPO-TEK® H35-175MPT EPO-TEK® H35-175MPT is a silver-filled epoxy for military hybrid die and component attach.
Thixotropic And High Temperature Epoxy -- EPO-TEK® H55 EPO-TEK® H55 is a thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.
Thermally Conductive Epoxy -- EPO-TEK® H67-MP EPO-TEK® H67-MP is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,...
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2LC EPO-TEK® H70E-2LC is a thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged...
Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S EPO-TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flow able consistency, designed...
Thermally Conductive Epoxy -- EPO-TEK® H73 EPO-TEK® H73 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74.
Thermally Conductive Epoxy -- EPO-TEK® H74 EPO-TEK® H74 is high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74. NASA...
High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74F EPO-TEK® H74F is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip...
High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H75 EPO-TEK® H75 is a thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to...
Thermally Conductive Epoxy -- EPO-TEK® H77 Black EPO-TEK® H77 Black is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar.
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND EPO-TEK® HYB-353ND is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-HV EPO-TEK® HYB-353ND-HV is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-LV EPO-TEK® HYB-353ND-LV is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-TX2 EPO-TEK® HYB-353ND-TX2 is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
High Temperature Hybrid Epoxy -- EPO-TEK® HYB-353ND-TX3 EPO-TEK® HYB-353ND-TX3 is a high temperature hybrid epoxy designed for semiconductor, fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial...
B-Stageable Epoxy Paste -- EPO-TEK® M10-D EPO-TEK® M10-D is a B-stage able epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. In opto-packaging, it can...
B-Stageable, Optical Grade Epoxy -- EPO-TEK® MA-5 EPO-TEK® MA-5 is a B-stage able, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed-through into...
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301 EPO-TEK® MED-301 is a Certified ISO 10993, biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are self-leveling, short pot-life, and ease of application, either by dispensing...
Biocompatible, Optically Transparent Epoxy -- EPO-TEK® MED-301-2 EPO-TEK® MED-301-2 is a Certified ISO 10993, biocompatible, clear and colorless, low viscosity, long pot-life, room temperature curing epoxy. Additional characteristics are: • Ease of use in potting and casting...
Biocompatible, Low Stress, Optical Epoxy -- EPO-TEK® MED-301-2FL EPO-TEK® MED-301-2FL is a biocompatible, low temperature curing, low stress and more flexible version of EPO-TEK® MED-301-2. It is used in fiber optic applications as well as potting, casting and...
Biocompatible, Optically Opaque Epoxy -- EPO-TEK® MED-302-3M Black EPO-TEK® MED-302-3M Black is a Certified ISO 10993, biocompatible, black, opaque, medium viscosity epoxy. Additional characteristics are: high moisture and chemical resistance and is capable of low temperature curing. It...
Biocompatible, Optically Transparent Epoxy -- EPO-TEK® MED-302-3M EPO-TEK® MED-302-3M is a Certified ISO 10993, biocompatible, clear and colorless, low viscosity epoxy, with high moisture and chemical resistance and is room temperature curing. Additional characteristics are: • Can...
Biocompatible, Opaque Epoxy -- EPO-TEK® MED-320 EPO-TEK® MED-320 is a Certified ISO 10993, black, biocompatible, thixotropic, low temperature curing, optically opaque epoxy for fiber optics, camera and photonic packaging, often used in bonding/potting/sealing of optics used...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-323LP EPO-TEK® MED-323LP is a biocompatible, high strength, high temperature, high Tg, long pot-life epoxy. It is used in many medical applications for adhesive, potting, sealing and encapsulation, especially suited for...
Biocompatible, High Temperature Epoxy -- EPO-TEK® MED-353ND EPO-TEK® MED-353ND is a Certified ISO 10993, biocompatible, high temperature, high Tg, and high strength epoxy. It has decades of use and reliability in medical device designs worldwide. Medical applications...
Biocompatible, High Temperature Thixotropic Epoxy -- EPO-TEK® MED-353ND-T EPO-TEK® MED-353ND-T is a Certified ISO 10993, biocompatible, thixotropic formulated version of EPO-TEK® MED-353ND. It has non-flowing properties (paste/non-sagging) and high temperature resistance. Some additional characteristics are: • Built-in color...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-354 EPO-TEK® MED-354 is a Certified ISO 10993, biocompatible, high Tg, medium viscosity epoxy with a very long (three days) pot life used in many medical applications, especially fiber optic endoscopy.
Biocompatible, Thixotropic Epoxy -- EPO-TEK® MED-354-T EPO-TEK® MED-354-t is a Certified ISO 10993, biocompatible, high Tg, thixotropic version of EPO-TEK® MED-354 epoxy. It is electrically and thermally insulating and formulated for medical applications with fiber optics,...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-375 EPO-TEK® MED-375 is a Certified ISO 10993, biocompatible, high Tg, high temperature epoxy. It has a color change upon cure and can provide near hermetic sealing. Additionally, it has excellent...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-377 EPO-TEK® MED-377 is a Certified ISO 10993, biocompatible, high Tg, high temperature epoxy. Due to its low viscosity, it is easy to use and can be applied easily by many...
Biocompatible, Electrically Conductive (ECA), Silver Epoxy -- EPO-TEK® MED-H20E EPO-TEK® MED-H20E is a Certified ISO 10993, biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of...
Biocompatible, Electrically Conductive, Silver Epoxy -- EPO-TEK® MED-H20S EPO-TEK® MED-H20S is a Certified ISO 10993, biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a smooth low viscosity paste with fine Ag particles. It is a...
Biocompatible, UV Hybrid Curing Epoxy -- EPO-TEK® MED-HYB-353ND EPO-TEK® MED-HYB-353ND is a biocompatible, high temperature specialty UV hybrid curing epoxy, formulated for process improvement (assembly) for photonic packaging. It has very high strength and moisture resistance.
Biocompatible, High Tg, Optical Epoxy -- EPO-TEK® MED-OD2002 EPO-TEK® MED-OD2002 is a Certified ISO 10993, biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistance and when cured...
Biocompatible, UV Curing Epoxy -- EPO-TEK® MED-OG116-31 EPO-TEK® MED-OG116-31 is a Certified ISO 10993, biocompatible, one component, thixotropic, high Tg, cationic/epoxy UV curing adhesive. With thermal post curing, this UV has very high chemical resistance and is...
Biocompatible, Shadow Curable Capable, UV Curing Epoxy -- EPO-TEK® MED-OG198-54 EPO-TEK® MED-OG198-54 is a Certified ISO 10993, biocompatible, clear, low viscosity, high Tg, high strength, cationic/epoxy UV curing adhesive. It has capillary wicking and is capable of reaching shadowed regions...
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110 EPO-TEK® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray,...
High Tg Optical Epoxy -- EPO-TEK® OD2002 EPO-TEK® OD2002 is a high Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364.
High Tg, High Temperature Grade Epoxy -- EPO-TEK® OE100T EPO-TEK® OE100T is a high Tg, high temperature grade epoxy designed for semiconductor, under fill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive...
Low Temperature Curing Epoxy Adhesive -- EPO-TEK® OE121-BLACK EPO-TEK® OE121-BLACK is an optical type, insulative conductivity, room cure method
Epoxy With Intermediate Viscosity Range -- EPO-TEK® OE138 EPO-TEK® OE138 is an epoxy with intermediate viscosity range between EPO-TEK®353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in fiber optic industries.
UV Cure Optical Epoxy -- EPO-TEK® OG142 EPO-TEK® OG142 is a UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, and scientific/OEM industries. It is a high Tg epoxy, ideal...
High Tg, Thermally Conductive, Semiconductor Die-Attach Grade Epoxy -- EPO-TEK® T6065 EPO-TEK® T6065 is a high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic...
Thermally Conductive And Electrically Insulating Epoxy -- EPO-TEK® T6067 EPO-TEK® T6067 is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,...
Thermally Conductive Epoxy -- EPO-TEK® T7109 EPO-TEK® T7109 is a thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, and optical industries.
Glob Top Epoxy -- EPO-TEK® T7139 EPO-TEK® T7139 is an electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.
Thermally Conductive Epoxy -- EPO-TEK® T905BN-3 EPO-TEK® T905BN-3 is thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications.
Spectrally Transparent Epoxy -- EPO-TEK® 301 EPO-TEK® 301 is a room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK® 301 Advantages & Suggested Application Notes: • Semiconductor: optical glob top or under...
Fast Setting, Optical Epoxy -- EPO-TEK® 302 EPO-TEK® 302 is a fast-gelling, room temperature curing epoxy, designed for electronic, optical, and general applications. EPO-TEK® 302 Advantages & Application Notes: • Due to its versatility, it may be...
Optically Transparent Epoxy -- EPO-TEK® 302-3M EPO-TEK® 302-3M is an epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. EPO-TEK® 302-3M Advantages &
Optically Transparent Epoxy Designed for REACH requirements -- EPO-TEK® 302-3M-R EPO-TEK® 302-3M-R is designed to meet European Regulatory Requirements. The epoxy is used for optical, fiber optic, and semiconductor applications and is good for adhesive joining, sealing, potting, or as...
Electrically Conductive, Silver Epoxy -- EPO-TEK® E2001 EPO-TEK® E2001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.
Electrically Conductive, Silver Epoxy -- EPO-TEK® E3001 EPO-TEK® E3001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E3001 Advantages & Application Notes: • Versatility & Cure: snap cures...
Electrically Conductive, Silver-Filled Epoxy -- EPO-TEK® E3001-6 EPO-TEK® E3001-6 is an electrically and thermally conductive, snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic device assembly.
Thermally Conductive Epoxy -- EPO-TEK® H65-175MP EPO-TEK® H65-175MP is an alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. EPO-TEK® H65-175MP Advantages...
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E EPO-TEK® H70E is a thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. EPO-TEK® H70E Advantages & Application Notes: • Heat-sinking adhesive. It is particularly...
Thermally Conductive Epoxy -- EPO-TEK® H72 EPO-TEK® H72 is a high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. EPO-TEK® H72 Advantages & Application Notes:...
Thermally Conductive Epoxy -- EPO-TEK® H77 EPO-TEK® H77 is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package...
Gold-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® H81 EPO-TEK® H81 is a gold-filled, electrically and thermally conductive epoxy designed for hybrid micro-electronic and semiconductor packaging. EPO-TEK® H81 Advantages & Application Notes: • Gold filled epoxy allows for anti-oxidation...
Biocompatible, High Temperature, Optical Epoxy -- EPO-TEK® MED-302-3M-R EPO-TEK® MED-302-3M-R is a biocompatible, clear and colorless, low viscosity epoxy designed to meet European Regulatory requirements. It has high moisture and chemical resistance and is room temperature curing. Additional...
High Temperature, Low CTE Epoxy -- EPO-TEK® OE188 EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. EPO-TEK® OE188 Advantages & Application Notes: • Paste-like viscosity allows for application by dispensing, or hand methods...