Epoxy Technology Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
Black, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S EPO TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flow able consistency,...
Electrically Conductive Epoxy -- EPO-TEK® H20E-FC EPO-TEK ® H20E-FC is an electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. EPO-TEK® H20E-FC Advantages & Application Notes: It is...
Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 430 EPO-TEK® 430 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding.
Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 431 EPO-TEK® 431 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding.
High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 920 EPO-TEK® 920 is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive...
Thermally Conductive Epoxy -- EPO-TEK® 920-FL EPO-TEK® 920-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity...
High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 921 EPO-TEK® 921 is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive...
High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 921-FL EPO-TEK® 921-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive...
Thermally Conductive Epoxy -- EPO-TEK® 930 EPO-TEK® 930 is a thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® 930-1 EPO-TEK® 930-1 is a thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics. It is a lower viscosity and smaller particle...
Thermally Conductive Epoxy -- EPO-TEK® 930-4 EPO-TEK® 930-4 is a thermally conductive epoxy, formulated with a very fine boron-nitride filler particle.
Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® B9126-7 EPO-TEK® B9126-7 is a thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing...
Thermally And Electrically Conductive Epoxy -- EPO-TEK® B9126-8 EPO-TEK® B9126-8 is a thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a one month pot-life, low temperature cure,...
Electrically Conductive Adhesive -- EPO-TEK® E3035 EPO-TEK® E3035 is a thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and...
Electrically Conductive Epoxy -- EPO-TEK® EJ2189 EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV EPO-TEK® EJ2189-LV is a low viscosity, room temperature curing conductive epoxy.
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000-MP
EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED...
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK2000 EPO-TEK® EK2000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED...
Silver-filled, Electrically Conductive Epoxy -- EPO-TEK® EV2118-2 EPO-TEK® EV2118-2 is a silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
Silver-Filled Epoxy With A Smooth Thixotropic Consistency -- EPO-TEK® H20E-D EPO-TEK® H20E-D is a silver-filled epoxy with a smooth thixotropic consistency. It is a version of EPO-TEKĀ® H20E designed primarily for enhanced dispensability.
Silver-filled Epoxy System -- EPO-TEK® H20E-HC EPO-TEK® H20E-HC is a silver-filled, electrically and thermally conductive epoxy, designed for semiconductor die-attach and hybrid microelectronic packaging. It can be used for heat sinking, plastic IC packaging in JEDEC...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR EPO-TEK® H20E-SLR is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-HV EPO-TEK® H20E-SLR-HV is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-HVMX EPO-TEK® H20E-SLR-HVMX is an electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing...
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-MX EPO-TEK® H20E-SLR-MX is an electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing...
Silver-Filled Epoxy With A Smooth, Thixotropic Consistency -- EPO-TEK® H20S-D EPO-TEK® H20S-D is a silver-filled epoxy with a smooth, thixotropic consistency. It is a version of EPO-TEK H20S designed primarily for enhanced dispensing.
Thermally Conductive Epoxy -- EPO-TEK® H61 EPO-TEK® H61 is a thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
Thixotropic And High Temperature Epoxy -- EPO-TEK® H61LV EPO-TEK® H61LV is a high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61.
Thixotropic And High Temperature Epoxy -- EPO-TEK® H61ND EPO-TEK® H61ND is a high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.
Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® H63 EPO-TEK® H63 is an electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK® H62.
Thermally Conductive Epoxy -- EPO-TEK® H67-MP EPO-TEK® H67-MP is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,...
Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® H70E-1 EPO-TEK® H70E-1 is a thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications.
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2LC EPO-TEK® H70E-2LC is a thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged...
Thermally Conductive Epoxy -- EPO-TEK® H73 EPO-TEK® H73 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74.
Thermally Conductive Epoxy -- EPO-TEK® H74 EPO-TEK® H74 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74.
High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74F EPO-TEK® H74F is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip...
High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H75 EPO-TEK® H75 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity...
Thermally Conductive Epoxy -- EPO-TEK® H77 Black EPO-TEK® H77 Black is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar.
Thermally Conductive, Electrically Insulating High-Temperature Epoxy Adhesive -- EPO-TEK® H77S EPO-TEK® H77S is a thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and under fill, hybrid microelectronics,...
Thermally Conductive Epoxy -- EPO-TEK® H77T EPO-TEK® H77T is a thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging, hybrid microelectronics, and optical. It is a more...
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110 EPO-TEK® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray,...
High Tg, Thermally Conductive, Semiconductor Die-Attach Grade Epoxy -- EPO-TEK® T6065 EPO-TEK® T6065 is a high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic...
Thermally Conductive And Electrically Insulating Epoxy -- EPO-TEK® T6067 EPO-TEK® T6067 is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,...
Thermally Conductive Epoxy -- EPO-TEK® T7109 EPO-TEK® T7109 is a thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, and optical industries.
Thermally Conductive, Room-Temperature Cure Epoxy -- EPO-TEK® T7110 EPO-TEK® T7110 is a thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such...
Glob Top Epoxy -- EPO-TEK® T7139 EPO-TEK® T7139 is an electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.
Thermally Conductive Epoxy -- EPO-TEK® T905BN-3 EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications.
Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ2183-LH EPO-TEK® TJ2183-LH is a low halogen, electrically insulating die attach adhesive with extended pot life.
Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TV2001 EPO-TEK® TV2001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of...
Thermally Conductive Epoxy -- EPO-TEK® TZ101 EPO-TEK® TZ101 is an electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an under fill for flip chip...
Electrically Conductive, Silver Epoxy -- EPO-TEK® E2001 EPO-TEK® E2001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E2001 Advantages & Application Notes: • This epoxy can offer advantages...
Electrically Conductive, Silver-Filled Epoxy -- EPO-TEK® E3001-6 EPO-TEK® E3001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E3001 Advantages & Application Notes: • Versatility & Cure: snap cures...
Electrically Conductive Epoxy -- EPO-TEK® H20E-MP EPO-TEK® H20E-MP is a 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to...
Thermally Conductive Epoxy -- EPO-TEK® H62 EPO-TEK® H62 is an electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits. EPO-TEK® H62 Advantages & Application Notes: • Black...
Thermally Conductive Epoxy -- EPO-TEK® H65-175MP EPO-TEK® H65-175MP is an alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. EPO-TEK® H65-175MP Advantages...
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E EPO-TEK® H70E is a thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. EPO-TEK® H70E Advantages & Application Notes: - Heat-sinking adhesive. It is particularly...
Thermally Conductive Epoxy -- EPO-TEK® H70E-175 EPO-TEK® H70E-175 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of...
Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2 EPO-TEK® H70E-2 is a thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged...
Thermally Conductive Epoxy -- EPO-TEK® H70E-4 EPO-TEK® H70E-4 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid...
Thermally Conductive Epoxy -- EPO-TEK® H72 EPO-TEK® H72 is a high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. EPO-TEK® H72 Advantages & Application Notes:...
Thermally Conductive Epoxy -- EPO-TEK® H77 EPO-TEK® H77 is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package...
Thermally Conductive Epoxy -- EPO-TEK® T905BN-4 EPO-TEK® T905BN-4 is a room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications. EPO-TEK® T905BN-4 Advantages & Application Notes: A moderate viscosity resin with...
Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TD1001 EPO-TEK® TD1001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and...