Epoxy Technology Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Black, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH | A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. |
| Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S | EPO TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flow able consistency,... |
| Electrically Conductive Epoxy -- EPO-TEK® H20E-FC | EPO-TEK ® H20E-FC is an electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. EPO-TEK® H20E-FC Advantages & Application Notes: It is... |
| Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 430 | EPO-TEK® 430 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. |
| Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 431 | EPO-TEK® 431 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. |
| High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 920 | EPO-TEK® 920 is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive... |
| Thermally Conductive Epoxy -- EPO-TEK® 920-FL | EPO-TEK® 920-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity... |
| High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 921 | EPO-TEK® 921 is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive... |
| High Tg, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® 921-FL | EPO-TEK® 921-FL is a high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive... |
| Thermally Conductive Epoxy -- EPO-TEK® 930 | EPO-TEK® 930 is a thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly. |
| Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® 930-1 | EPO-TEK® 930-1 is a thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics. It is a lower viscosity and smaller particle... |
| Thermally Conductive Epoxy -- EPO-TEK® 930-4 | EPO-TEK® 930-4 is a thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. |
| Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® B9126-7 | EPO-TEK® B9126-7 is a thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing... |
| Thermally And Electrically Conductive Epoxy -- EPO-TEK® B9126-8 | EPO-TEK® B9126-8 is a thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a one month pot-life, low temperature cure,... |
| Electrically Conductive Adhesive -- EPO-TEK® E3035 | EPO-TEK® E3035 is a thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and... |
| Electrically Conductive Epoxy -- EPO-TEK® EJ2189 | EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. |
| Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV | EPO-TEK® EJ2189-LV is a low viscosity, room temperature curing conductive epoxy. |
|
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000-MP |
EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED... |
| Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK2000 | EPO-TEK® EK2000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED... |
| Silver-filled, Electrically Conductive Epoxy -- EPO-TEK® EV2118-2 | EPO-TEK® EV2118-2 is a silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly. |
| Silver-Filled Epoxy With A Smooth Thixotropic Consistency -- EPO-TEK® H20E-D | EPO-TEK® H20E-D is a silver-filled epoxy with a smooth thixotropic consistency. It is a version of EPO-TEK® H20E designed primarily for enhanced dispensability. |
| Silver-filled Epoxy System -- EPO-TEK® H20E-HC | EPO-TEK® H20E-HC is a silver-filled, electrically and thermally conductive epoxy, designed for semiconductor die-attach and hybrid microelectronic packaging. It can be used for heat sinking, plastic IC packaging in JEDEC... |
| Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR | EPO-TEK® H20E-SLR is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and... |
| Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-HV | EPO-TEK® H20E-SLR-HV is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and... |
| Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-HVMX | EPO-TEK® H20E-SLR-HVMX is an electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing... |
| Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR-MX | EPO-TEK® H20E-SLR-MX is an electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing... |
| Silver-Filled Epoxy With A Smooth, Thixotropic Consistency -- EPO-TEK® H20S-D | EPO-TEK® H20S-D is a silver-filled epoxy with a smooth, thixotropic consistency. It is a version of EPO-TEK H20S designed primarily for enhanced dispensing. |
| Thermally Conductive Epoxy -- EPO-TEK® H61 | EPO-TEK® H61 is a thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. |
| Thixotropic And High Temperature Epoxy -- EPO-TEK® H61LV | EPO-TEK® H61LV is a high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61. |
| Thixotropic And High Temperature Epoxy -- EPO-TEK® H61ND | EPO-TEK® H61ND is a high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. |
| Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® H63 | EPO-TEK® H63 is an electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK® H62. |
| Thermally Conductive Epoxy -- EPO-TEK® H67-MP | EPO-TEK® H67-MP is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,... |
| Thermally Conductive, Electrically Insulating Epoxy Adhesive -- EPO-TEK® H70E-1 | EPO-TEK® H70E-1 is a thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications. |
| Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2LC | EPO-TEK® H70E-2LC is a thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged... |
| Thermally Conductive Epoxy -- EPO-TEK® H73 | EPO-TEK® H73 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74. |
| Thermally Conductive Epoxy -- EPO-TEK® H74 | EPO-TEK® H74 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74. |
| High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74F | EPO-TEK® H74F is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip... |
| High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H75 | EPO-TEK® H75 is a high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity... |
| Thermally Conductive Epoxy -- EPO-TEK® H77 Black | EPO-TEK® H77 Black is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. |
| Thermally Conductive, Electrically Insulating High-Temperature Epoxy Adhesive -- EPO-TEK® H77S | EPO-TEK® H77S is a thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and under fill, hybrid microelectronics,... |
| Thermally Conductive Epoxy -- EPO-TEK® H77T | EPO-TEK® H77T is a thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging, hybrid microelectronics, and optical. It is a more... |
| Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110 | EPO-TEK® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray,... |
| High Tg, Thermally Conductive, Semiconductor Die-Attach Grade Epoxy -- EPO-TEK® T6065 | EPO-TEK® T6065 is a high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic... |
| Thermally Conductive And Electrically Insulating Epoxy -- EPO-TEK® T6067 | EPO-TEK® T6067 is a thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking,... |
| Thermally Conductive Epoxy -- EPO-TEK® T7109 | EPO-TEK® T7109 is a thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, and optical industries. |
| Thermally Conductive, Room-Temperature Cure Epoxy -- EPO-TEK® T7110 | EPO-TEK® T7110 is a thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such... |
| Glob Top Epoxy -- EPO-TEK® T7139 | EPO-TEK® T7139 is an electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly. |
| Thermally Conductive Epoxy -- EPO-TEK® T905BN-3 | EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications. |
| Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ2183-LH | EPO-TEK® TJ2183-LH is a low halogen, electrically insulating die attach adhesive with extended pot life. |
| Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TV2001 | EPO-TEK® TV2001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of... |
| Thermally Conductive Epoxy -- EPO-TEK® TZ101 | EPO-TEK® TZ101 is an electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an under fill for flip chip... |
| Electrically Conductive, Silver Epoxy -- EPO-TEK® E2001 | EPO-TEK® E2001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E2001 Advantages & Application Notes: • This epoxy can offer advantages... |
| Electrically Conductive, Silver-Filled Epoxy -- EPO-TEK® E3001-6 | EPO-TEK® E3001 is a silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. EPO-TEK® E3001 Advantages & Application Notes: • Versatility & Cure: snap cures... |
| Electrically Conductive Epoxy -- EPO-TEK® H20E-MP | EPO-TEK® H20E-MP is a 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to... |
| Thermally Conductive Epoxy -- EPO-TEK® H62 | EPO-TEK® H62 is an electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits. EPO-TEK® H62 Advantages & Application Notes: • Black... |
| Thermally Conductive Epoxy -- EPO-TEK® H65-175MP | EPO-TEK® H65-175MP is an alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. EPO-TEK® H65-175MP Advantages... |
| Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E | EPO-TEK® H70E is a thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. EPO-TEK® H70E Advantages & Application Notes: - Heat-sinking adhesive. It is particularly... |
| Thermally Conductive Epoxy -- EPO-TEK® H70E-175 | EPO-TEK® H70E-175 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of... |
| Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H70E-2 | EPO-TEK® H70E-2 is a thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged... |
| Thermally Conductive Epoxy -- EPO-TEK® H70E-4 | EPO-TEK® H70E-4 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid... |
| Thermally Conductive Epoxy -- EPO-TEK® H72 | EPO-TEK® H72 is a high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. EPO-TEK® H72 Advantages & Application Notes:... |
| Thermally Conductive Epoxy -- EPO-TEK® H77 | EPO-TEK® H77 is a thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package... |
| Thermally Conductive Epoxy -- EPO-TEK® T905BN-4 | EPO-TEK® T905BN-4 is a room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications. EPO-TEK® T905BN-4 Advantages & Application Notes: A moderate viscosity resin with... |
| Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TD1001 | EPO-TEK® TD1001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and... |