EPO-TEK¬Æ H74F is a two-component, high glass transition temperature (Tg), thermally conductive, and electrically insulating epoxy. It is specifically designed for applications in semiconductor packaging, including heat sinking, hermetic sealing, and opto-electronic assemblies. The recommended cure condition is 150¬8C for one hour, with alternative curing options available at lower temperatures, though performance may vary. The epoxy exhibits a specific gravity of 2.02 for Part A and 1.02 for Part B, with a viscosity range of 45,000 to 75,000 cPs at 23¬8C. It has a thixotropic index of 1.9 and a glass transition temperature of at least 90¬8C. The thermal conductivity is measured at 0.5 W/mK, and it maintains a volume resistivity of at least 5 x 10^13 Ohm-cm at 23¬8C. The product is suitable for applications requiring high thermal management while providing electrical insulation. EPO-TEK¬Æ H74F has a pot life of three hours and a shelf life of one year at room temperature for bulk packaging. It is important to note that the performance properties may vary based on batch conditions and application methods. The epoxy is compatible with various industries, including aerospace, automotive, electronics, and medical applications.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® H74F |
| Product Name | High Tg, Thermally Conductive, Electrically Insulating Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Features | High Dielectric; Thermally Conductive |
| Substrate Compatibility | Metal; Plastic |
| Industry | Electronics; Semiconductors, IC's |
