Epoxy Technology Thermally Conductive Epoxy EPO-TEK® H74

EPO-TEK¬Æ H74 is a two-component thermally conductive epoxy designed for applications such as hybrid circuit assembly, die attach, substrate attach, lid-seal, and heat dissipation. It features a recommended cure temperature of 150¬8C for one hour, with alternative curing options available at lower temperatures. The epoxy has a specific gravity of 2.11 for Part A and 1.02 for Part B, and a pot life of two hours at room temperature. The product exhibits a thixotropic paste consistency, allowing for easy application through dispensing or manual methods. It has a thermal conductivity of 1.3 W/mK and a volume resistivity of ,â 4 x 10^12 Ohm-cm, making it suitable for electrically insulating applications. The epoxy also demonstrates excellent high-temperature resistance, with a suggested operating temperature of less than 350¬8C intermittently, and it passes NASA's low outgassing standard ASTM E595 when properly cured. EPO-TEK¬Æ H74 is characterized by its color change during curing, which serves as an indicator of the curing process. It is suitable for use in demanding environments, including aerospace, automotive, electronics, and medical applications. The product has a shelf life of one year at room temperature and should be stored in closed containers to maintain its properties.