EPO-TEK¬Æ H21D is a two-component, silver-filled epoxy designed for applications requiring electrical conductivity, particularly in microelectronic and optoelectronic fields. It features a recommended cure temperature of 150¬8C for one hour, with alternative curing options available at lower temperatures. The mix ratio by weight is 10:1, and the product has a pot life of 15 hours. The epoxy exhibits a specific gravity of 2.45 for Part A and 2.14 for Part B, with a viscosity range of 25,000 to 40,000 cPs at 23¬8C. It has a glass transition temperature of at least 100¬8C and a thermal conductivity of 1.0 W/mK. The volume resistivity is ,⧠0.0009 Ohm-cm at 23¬8C, making it suitable for applications requiring low electrical resistance. EPO-TEK¬Æ H21D is noted for its extended pot life and low outgassing properties, making it NASA-approved for use in sensitive environments. It is compatible with Au-plated ceramic substrates and can be applied using various methods, including commercial dispensing equipment and manual techniques. The product is recommended for use in hybrid aerospace circuits and other demanding applications, with a suggested operating temperature of less than 350¬8C for intermittent use.
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966.
Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® H21D |
| Product Name | Electrically Conductive, Silver Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Composition | Filled |
| Features | Electrically Conductive; Thermally Conductive |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
