EPO-TEK¬Æ H22 is a two-component, silver-filled epoxy designed for die bonding and sealing hybrid circuit packages. It features a recommended cure temperature of 150¬8C for one hour, with alternative curing options available at lower temperatures. The product has a pot life of 16 hours and a shelf life of one year at room temperature. The epoxy exhibits a smooth, thixotropic paste consistency and has a viscosity range of 17,000 to 30,000 cPs at 23¬8C. It has a glass transition temperature of ,â 100¬8C and a degradation temperature of 454¬8C. The product demonstrates excellent thermal and electrical properties, including a thermal conductivity of 0.9 W/mK and a volume resistivity of ,⧠0.005 Ohm-cm at 23¬8C. EPO-TEK¬Æ H22 is suitable for high-temperature applications, with suggested operating temperatures below 350¬8C. It is solvent-free and passes NASA's low outgassing standard ASTM E595 when properly cured. This epoxy can be used as an alternative to eutectic solders for near-hermetic sealing and is applicable in various industries, including semiconductor packaging and military applications.
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966.
Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® H22 |
| Product Name | Electrically Conductive, Silver Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Composition | Filled |
| Features | Electrically Conductive; Thermally Conductive |
| Substrate Compatibility | Metal; Plastic |
