EPO-TEK¬Æ 930-4 is a two-component thermally conductive epoxy designed for applications requiring effective heat dissipation and electrical insulation. It features a mix ratio by weight of 100:3.3 and is recommended to cure at 150¬8C for one hour, with alternative curing options available at lower temperatures. The epoxy has a specific gravity of 1.31 for Part A and 1.02 for Part B, and a pot life of one day, which is reduced to six hours when using a syringe. This product exhibits a thermal conductivity of 1.7 W/mK and a volume resistivity of ,â 2 x 10^13 Ohm-cm at 23¬8C. It has a glass transition temperature of ,â 90¬8C and a degradation temperature of 425¬8C. The epoxy is suitable for bonding to various substrates, including metals, ceramics, and plastics, making it versatile for semiconductor applications, heat sink attachment, and other electronic assemblies. EPO-TEK¬Æ 930-4 is characterized by its smooth paste consistency and thixotropic index of 2.4, allowing for ease of application through various methods such as screen printing and automated dispensing. It also features a color change that indicates optimal curing, transitioning from off-white to amber. The product meets NASA's low outgassing standards when properly cured, making it suitable for demanding environments.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® 930-4 |
| Product Name | Thermally Conductive Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Composition | Filled |
| Features | Thermally Conductive |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
