EPO-TEK¬Æ H77 is a two-component thermally conductive epoxy designed for applications requiring electrical insulation and heat management, particularly in hermetic packaging of micro-electronics. It is suitable for sealing lids made from various materials, including ceramic, glass, aluminum, and kovar, and can be used with different package types such as plastic, metal, or ceramic cases. The recommended cure condition is 150¬8C for one hour, with alternative curing options available. The epoxy exhibits a specific gravity of 2.70 for Part A and 1.22 for Part B, and has a pot life of six hours. Its physical properties include a viscosity range of 6,000 to 12,000 cPs at 23¬8C, a glass transition temperature of ,â 80¬8C, and a Shore D hardness of 90. The thermal conductivity is measured at 0.7 W/mK, while the volume resistivity is ,â 1 x 10^13 Ohm-cm. EPO-TEK¬Æ H77 demonstrates excellent chemical and solvent resistance, making it suitable for harsh environments in industries such as aerospace, automotive, and medical applications. It also meets NASA's low outgassing standards and is recommended for ultra-high vacuum applications. The product is available in various viscosities and particle sizes to accommodate specific project requirements.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® H77 |
| Product Name | Thermally Conductive Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Chemical System | Epoxy |
| Features | High Dielectric; Encapsulant, Potting Compound; Thermally Conductive |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
| Industry | Aerospace; Electronics |
