EPO-TEK¬Æ EK1000-MP is a single-component, silver-filled epoxy adhesive designed for applications requiring high thermal and electrical conductivity. It is particularly suitable for high power LED die attach applications and complies with MIL-STD 883/Test Method 5011. The adhesive features a low viscosity and high thixotropy, allowing for versatile application techniques. The recommended cure condition is 200¬8C for one hour, with a pot life of two weeks and a dry time of less than one day. The product has a specific gravity of 3.34 and a shelf life of one year when stored at -40¬8C. Key physical properties include a viscosity range of 1,800 to 3,600 cPs at 23¬8C and a glass transition temperature of at least 80¬8C. The adhesive exhibits a thermal conductivity of 12.6 W/mK at 150¬8C and 26.3 W/mK at 23¬8C, along with a volume resistivity of ,⧠0.00009 Ohm-cm. Mechanical properties include a lap shear strength of 1,010 psi at 23¬8C and a die shear strength of ,â 10 Kg initially, decreasing to ,â 5 Kg after 1,000 hours at 85¬8C and 85% relative humidity. The adhesive can withstand temperatures up to 300¬8C intermittently and has a degradation temperature of 357¬8C.
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966.
Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).
| Epoxy Technology | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EPO-TEK® EK1000-MP |
| Product Name | Electrically and Thermally Conductive Epoxy Adhesive |
| Cure / Technology | Thermoset; Single Component |
| Chemical System | Epoxy |
| Composition | Filled |
| Features | Electrically Conductive; Thermally Conductive |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
