LOCTITE HF 212 Applications Solder Paste for Medium and Large Board Assemblies LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications. Halogen Free
Meets all current “Halogen-free” restrictions
No added Halogen
Halide-free: ROL0 classification in accordance to j-STD-004B
Compatible with existing halogen-free solutions Ease of Application
Excellent wetting capabilities Technology Printing and Reflow Advantages
Wide process window for printing and minimal slump
Fine pitch capability and reduction in solder bridging
Excellent abandon time and stencil life
Excellent humidity resistance
Excellent solderability on challenging surface finishes (includes CuNiZn and Copper OSP)
Improves fine pitch coalescence Low Voiding
In CSP
On industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag
Increases solder joint reliability
> View the LOCTITE HF 212 landing page
LOCTITE HF 212 Applications
Solder Paste for Medium and Large Board Assemblies
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
Halogen Free
- Meets all current “Halogen-free” restrictions
- No added Halogen
- Halide-free: ROL0 classification in accordance to j-STD-004B
- Compatible with existing halogen-free solutions
Ease of Application
- Excellent wetting capabilities
Technology Printing and Reflow Advantages
- Wide process window for printing and minimal slump
- Fine pitch capability and reduction in solder bridging
- Excellent abandon time and stencil life
- Excellent humidity resistance
- Excellent solderability on challenging surface finishes (includes CuNiZn and Copper OSP)
- Improves fine pitch coalescence
Low Voiding
- In CSP
- On industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag
- Increases solder joint reliability
> View the LOCTITE HF 212 landing page
