Henkel Corporation - Electronics LOCTITE DA 100

Description
Halide-free, No-clean, SnPbDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in Pb-free formulation
  • LOCTITE DA 100 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
Halide-free, No-clean, SnPbDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in Pb-free formulation

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Product
Description
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LOCTITE DA 100 - - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
LOCTITE DA 100
LOCTITE DA 100
Halide-free, No-clean, SnPbDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in Pb-free formulation

Halide-free, No-clean, SnPbDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in Pb-free formulation

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Filler Alloys and Consumables
Product Name LOCTITE DA 100
Joining Process / Product Form Braze or solder in the form of a paste.
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