MacDermid Alpha Electronics Solutions Capillary Underfill ALPHA® HiTech™ CU11-3127

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Capillary Underfill - ALPHA® HiTech™ CU11-3127 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Capillary Underfill ALPHA® HiTech™ CU11-3127
ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending.
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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Encapsulants and Potting Compounds
Product Number ALPHA® HiTech™ CU11-3127
Product Name Capillary Underfill
Industry Electronics; Semiconductors, IC's
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