MacDermid Alpha Electronics Solutions ATROX ® 590-4HT1

Description
Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out.
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Description
Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out.
Request a Quote

Suppliers

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ATROX ® 590-4HT1 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ATROX ® 590-4HT1
ATROX ® 590-4HT1
Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out.

Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages.

Product Overview

ATROX® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Name ATROX ® 590-4HT1
Composition Filled
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