Technic, Inc. Datasheets for Plating Chemicals and Anodizing Chemicals

Plating chemical and anodizing chemicals include metal salts, formula additives, and other consumables for the electrodeposition, electroless plating, electroplating and anodized layer formation.
Plating Chemicals and Anodizing Chemicals: Learn more

Product Name Notes
Soft Gold For Deep Tank Applications -- 434 HS 34 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits...
Acid Copper -- Technic CU 2800 TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of todayís complex printed circuit board designs. Providing excellent throwing power over a...
Elevate® Gold 7934 A cyanide based electrolytic gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate...
Techni IM Gold AT8000 A cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and Techni IM Gold AT6100 additive. During this reaction Ni is...
High Speed Nickel Plating Deposit -- Goldeneye Level Nickel A fully bright, leveled nickel deposit with high hardness and corrosion resistance.
Matte to Bright Silver Plating Process -- Techni Silver HCD A high speed silver plating process designed to operate with inert anodes and very low concentrations of free cyanide, over a wide CD range.
Elevate® Ni 5930 A high throwing power nickel sulfate bath that can improve distribution and reduce plating times on difficult to plate complex features.
Elevate® Tin 5011 A High-speed pure tin process that produces a deposit that is fine-grained with low organic impurities and is whisker resistant. The process is formulated to provide excellent coplanarity across the...
High Speed Nickel Plating Process -- Goldeneye Nickel ORC A low stress/highly corrosion resistant nickel deposit which protects over plated bright tin from discoloration during thermal exposure.
High Speed Nickel Plating Process -- Goldeneye Nickel A low stress/highly corrosion resistant nickel deposit.
Elevate®Cu 6340 A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no...
Electrolytic Nickel-phosphorous Alloy Plating Process -- Techni NiPhos 611 A nickel-phosphorous alloy plating process which provides a deposit containing 6-11% Phosphorous for increased corrosion resistance in reel to reel electronic component and connector plating applications.
Durasil® Post Treatment
Durasil® Post Treatment
A non aqueous process which provides improved wera resistance and corrosion-resistant properties to Durasil® Silver deposits.
Post-Treatment Processes -- Techni Neutralizer E260 A post-treatment process offering maximum protection of tin deposits from discoloration in extreme dry heat thermal exposure conditions (e.g., reflow).
Bright Hard Silver -- Durasil® Silver A proprietary silver alloy plating process designed to replace gold in reel to reel electronic component and connector applications. Provides excellent conductivity, superior corrosion resistance and improved wear resistance compared...
Alkaline Copper -- Techni Copper P Solution A semi to bright pyrophosphate copper solution used as an alternative to copper cyanide.
Matte to Bright Silver Plating Process -- Techni Silver HCD A silver plating process designed to operate with inert anodes and very low concentrations of free cyanide. Recommended where high purity, heat resistant deposits with excellent die and wire bonding...
Technic CU 2900 A truly unique acid copper plating process specifically designed to meet the demands of today’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range.
Gold Strike on Basis Metals -- Orostrike C Acid Gold Acid Gold with excellent adhesion on basis metals like nickel with high tolerance for resist contamination.
Clarifies and Regenerates All of Technicecs Proprietary Tin and Tin/lead Plating Processes -- Techni Tin Lead Clear A Flock Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath.
Elevate® Ni 5910 All purpose nickel sulfamate bath that provides a low stress and ductile deposit. Low maintenance and long bath life are prominent attributes of this process.
Post-Treatment Processes -- Technic PST Neutralizer An alkaline post-treatment process that effectively neutralizes acid films from tin and tin alloy plating process residues.
Techni EL Palladium AT7015 An extremely stable process capable of depositing over 10 microinches of Pd with a 2-3% phosphorus content. Techni EL Palladium AT7015 deposit is engineered for applications with gold wire bonding,...
Techni Copper U Solution Bright acid copper solution used for decorative and electroforming applications.
Cyanide Copper Strike and Full Build -- CUCN Bright cyanide copper especially design for difficult to plate substrates such as leaded brass.
Nickel Sulfate Plating -- Technic JB Nickel Bright decorative finish for both rack and barrel plating.
Technic Rhodium Bright white sulfate high throw process.
Rhodium Plate -- RH 221 D Bright white sulfate process with excellent corrosion resistance.
Rhodium Plate -- RH 221 E Bright white sulfate process.
High Speed Bright Tin Plating Process. MSA Based Electrolyte -- Techni NF JB 3000 Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.
Decorative Hard Gold Brilliant decorative 24K hard gold 24K.
Tri-alloy (Cu, Sn, Zn) Plating -- Techni White EGB Brilliant white deposit for decorative applications.
Low Stress, Semi-bright, Ductile Nickel Plating Process -- Techni Nickel S Can be used as a nickel underplate or final finish. Easy to operate and control. Full bright deposit. A general purpose bath which should be recommended for all non-critical applications.
Passive Component Electroplating -- Ceramistan DM Ceramistan DM is a near-neutral pH matte tin or tin/lead plating process for standard chip capacitor/chip resistor barrel plating and/or SBE applications.
Pd/Ni Alloy, Semi-bright, 60-90% Palladium -- Pallaspeed® PdNi 985 Chloride-free, low ammonia process exhibits superior corrosion resistance. Low stress. Operates at 100-500 ASF. Recommended undercoat for applications requiring gold flash.
Bright Nickel Plating Process -- MX8-M Designed for application where a very white level deposit is required for the final nickel plate.
Mid "Phos" Electroless Nickel -- Techni EN 2600 Designed for high bath loading in plating of steel, aluminum and metal alloys.
RoHS Compliant Mid "Phos" Electroless Nickel -- Techni EN 8500 Designed for high bath loading in plating RoHS compliant mid phos nickel deposit on steel, aluminum and metal alloys. Bath is formulation to be auto ph adjusting.
RoHS Compliant Mid "Phos" Electroless Nickel -- Techni EN 8200 Designed for high bath loading in plating RoHS compliant mid phos nickel deposit on steel, aluminum and metal alloys.
Copper Cyanide Rochelle Strike Designed to give good adhesion and coverage with a relative low level of thickness. This is followed by a high deposition bath.
Double Sided Screen Printer -- DP2500 Double sided screen priniter for flexible substrates.
DC Copper For Medium to High Technology -- Technic CU 2300 Easy to use, low cost two component, analyzable.
PPR Copper For Medium to High Technology -- TechniPulse CU5300 Easy to use, stable PPR process yielding a bright deposit.
Copper Plating -- Elevate® Cu 6320 Electrolytic acid copper process specifically engineered to provide excellent throwing power and distribution. This process maintains superior performance over a wide range of current densities.
Elevate® Gold 7990 Electrolytic sulfite gold process that produces pure, soft gold deposits. Operates at an acidic pH, making it compatible with almost all photoresists. Elevate Gold 7990 produces a bright deposit without...
Electroless Nickel Immersion Gold Process -- TechniPad ENIG ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.
Alkaline Cyanide Copper Strike -- Techni Copper ACP Exhibits improved copper and molding compound adhesion.
Technic Antique Gold For smuts, hues, and highlights.
Woods Nickel Strike Formulation used for improved adhesion over difficult to plate base materials such as Kovar, Alloy 52 and Stainless Steel prior to subsequent plating.
Mid Phos (7-8% P) Electroless Nickel Plating Process -- Techni EN 2600 Full bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Techni MSI CuCN Bright Copper Cyanide Full bright process used for both strike and full build applications.
Sulfate Based Matte Tin -- Techni Matte Tin Sulfate 89TI General purpose, low cost matte tin plating process for barrel plating applications.
Specialty Finish Gold -- Technic Trushade Gold concentrate for 24K and color gold flash baths.
Nickel Hardened Barrel Gold Plating Process -- Techni Gold® Barrel 850 Gold plating process designed to minimize porosity in electronic component and connector barrel plating applications.
Cobalt Hardened Flash Gold Plating Process -- Techni Gold® Flash 950
Nickel Hardened Flash Gold Plating Process -- Techni Gold® Flash 850
Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.
Cobalt Hardened Gold Plating Process -- Techni Gold® 900
Nickel Hardened Gold Plating Process -- Techni Gold® 800
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Gold Strike -- EAS Gold strike for stainless steel.
Elevate® AuSn 8020 Gold-tin alloy plating process that produces alloy ranges from 75 – 82% gold content with a corresponding melting point of 280°C – 320°C. Optimum gold-tin alloys are produced from a...
Decorative Hard Gold -- Cote D'Or® Green-yellow bright hard gold for heavy decorative deposits.
Decorative Hard Gold -- Orosene 999® Gold Hard Gold 24K--Type I, II Grade C designed for both rack and barrel operations.
Barrel Plating -- MX-5
Rack Plating -- MX8-M
High leveling one component system.
High Speed Matte Tin Sulfate Process Designed for Use on Lines with In-line Tin Reflow Furnaces -- Technistan TP
High Speed Pure Tin Process for Reel-to-reel Continuous Strip Applications -- Technistan TP
High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
High Speed Matte/satin Pure Tin for Wire Applications -- Technistan TP-W High speed matte pure tin process based on sulfuric acid technology. Offers significant cost advantages to MSA systems.
Ultra Bright Silver Plating Process -- Techni Silver® LED HS Brightener
Ultra Bright Silver Plating Process -- Techni Silver® LED HS Makeup
Ultra Bright Silver Plating Process -- Techni Silver® LED HS Supplemental Additive
High speed reel-to-reel process which produces ultra bright reflective surfaces on LED substrates.
High Speed Pure Silver Plating Process for Spot Plating Applications -- EHS-3R High speed, phosphate based electrolyte designed for reel-to-reel and cut strip silver spot plating applications.
Elevate® Cu 6370 High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute can be attained on...
Hard Gold for Rack and Barrel Application -- Orosene® 990 Industry standard for hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.
Matte Tin for Rack and Barrel -- Techni Matte Tin Sulfate 89TI Low operating cost. Good product for most technology types. Optimum distribution in the range of 15 - 20 ASF.
Technic Acid Gold Strike Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
DC Copper For Flexible Circuit Boards -- TechniFlex CU120 Low stress, excellent ductility designed for thin substrates.
Sulfate Based Matte Tin. Sulfate Based Electrolyte -- Technistan JM 6000 LS Matte whisker resistant deposit. Recommended for rack/barrel applications (up to 4 ASD).
Matte Tin or Tin/lead Plating Process. MSA Based Electrolyte -- Techni NF JM 6000 Medium grained, high speed, matte tin whisker resistant plating process based on MSA. Satisfies all requirements of JEDEC JESD 201. Can be formulated as a tin/lead process.
Elevate® Platinum 7810 Mildly acidic platinum plating solution formulated for a variety of semiconductor applications including MEMS and fuel cells. The solution is particularly suitable for obtaining heavy deposits.
Rack and Barrel Plate -- Silver Cyless® II W Mirror bright silver with excellent wear resistance.
Silver Plate -- 1006 Silver Mirror-bright ductile decorative deposit with excellent wear resistance.
Tin & Tin Alloy Alloy -- Techni NF JM 8000 MSA tin process for use in rack, barrel and high speed RTR equipment. Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing...
Rack and Barrel Plate -- Silver Cyless® II Non-cyanide, semi-bright to bright silver plating process.
Matte Tin Etch Resist for Rack and Barrel -- Tin Spray Non-foaming process providing a fine grained tin deposit.
Acid Copper -- Copper U One additive bright copper used for decorative and electroforming applications.
MSA-based Bright Tin and Tin/lead Plating Process -- Techni NF BT2 Operates over a wide CD range for increased output and flexibility in production. Produces brilliant deposits with good ductility. Exhibits good throwing power and distribution characteristics.
Silver -- Tarniban® D Organic, thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.
Silver Plate -- Silversene DW Organically brightened deposit for both rack and barrel operation.
Orosene 80RC Orosene 80RC is the industry standard colbalt brightened acid gold process. The deposit meets the requirements for type I and II, gradeC, of ASTM B488-01. The solution is compatible with...
Orosene 990HS Orosene 990 HS is a high speed, high efficiency hard gold formulation that mini- mizes hydrogen evolution and provides improved edge adhesion on dry film resists. It has a stable...
Gold Alloys Pink, green and Ni standard alloy additives.
Post-Treatment Processes -- Techni X-510 Post-treatment chemistry specifically designed for use after the Technistan Ag Sn-Ag alloy electroplating process.
Post Treatment Process for Tin and Tin Alloys -- Tarniban® E260 Protects tin deposits from oxidation and discoloration following post-plate high temperature dry thermal exposure. Optimum results when used in combination with Techni Nickel TS. Recommended for rack, barrel and high...
Pure Palladium for Deep Tank Applications -- Pallaspeed® S Pure palladium process engineered for compatibility with aqueous dry film. Wide current density and metal concentration range. Typically utilized where better chemical resistance is required like in deep well applications.
Pyrophosphate Copper Strike and Plate -- Techni Copper P Purified liquid concentrates providing a semi-bright finish.
Techni Silver® LED LF Primary
Ultra Bright Silver Plating Process -- Techni Silver® LED LS Brightener
Ultra Bright Silver Plating Process -- Techni Silver® LED MS Brightener
Rack, barrel and mediuim speed reel-to-reel process which produces ultra bright reflective surfaces on LED substrates.
Post Treatment for Silver -- Tarniban® E Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.
Post Treatment for Tin and Nickel -- Tarniban® S18 Recommended for protection of metal surfaces subjected to post plate salt spray corrosion testing (See ASTM B117). This product has been demonstrated to be effective on nickel, tin and thin...
Treatment for Removal of Stannic Tin -- Techni Tin Lead Clear A Flock Recommended for use in tin and tin alloy baths. Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath.
Replenishable PGC Based Immersion Gold Chemistry -- Techni IM Gold AT 6000 Replenishable PGC based immersion gold chemistry. It will deposit 2-4 microinches of gold on electroless nickel in 10 minutes. Techni IM Gold AT 6000 has a high tolerance for metallic...
Pure Palladium Plate -- Pallaspeed® Rhodium-look finish - lower costs can deposit directly on copper, nickel alloys without a strike.
Cyanide Copper Strike -- Copper C Semi bright deposit to provide adhesion on difficult to plate metals.
Low Phos (1-4% P) Electroless Nickel Plating Process -- Techni EN 1400 Semi bright EN deposit, deposition rate 300-400 u/hr (7-10 u/hr).
High Phos (10-12% P) Electroless Nickel Plating Process -- Techni EN 3500 Semi bright EN deposit, deposition rate 400-600 u-in/hr (10-15 um/hr). Highest level of corrosion resistance.
Mid Phos (7-8% P) Electroless Nickel Plating Process -- Techni EN 2600 SB Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Semi-bright Cyanide Copper Strike -- Techni Copper C Semi bright strike process. Recommended for difficult to plate metals.
Immersion Silver -- TechniSol Silvermerse Silver final finish for solderability protection on solar cells.
Tin & Tin Alloy Alloy -- Technistan JM 7000 Sulfate tin process for use in in rack, barrel and high speed RTR equipment. Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great...
Post-Treatment Processes -- Tarniban® 60 Tarniban 60 is a post-treatment process which effectively protects silver deposits from oxidation/tarnishing especially when subjected to high thermal exposure environments. Tarniban 60 forms a thin, transparent film on the...
Post-Treatment Processes -- Tarniban C48 Tarniban C48 forms a thin, benign, transparent film on tin and tin alloy deposits and effectively protects them during exposure to high temperature / high humidity environments. Tarniban C48 minimizes...
Post-Treatment Processes -- Tarniban® C50 Tarniban C50 offers similar benefits as the Tarniban C48 with added protection from extreme dry heat exposure (e.g., reflow).
Post-Treatment Processes -- Tarniban CBG Tarniban CBG is a post-treatment process which effectively protects gold plated surfaces from corrosion and oxidation. When used as directed, Tarniban CBG forms a thin, colorless, transparent film on the...
Post-Treatment Processes -- Tarniban KS II Tarniban KS II is a post-treatment process which effectively protects silver surfaces from oxidation/tarnishing. It may be used as an immersion only process or applied anodically for increased protection. When...
Techni-Gold 1020C (HS) / Techni Gold 1020N (HS) Techni Gold 1020C (HS) is a mildly acidic cobalt brightened gold plating solution recommended for use in high speed and selective plating applications. The solution operates at relatively low gold...
Techni-Gold 300 / Techni-Gold 400 Techni Gold 300 is a mildly acidic nickel brightened gold plating solution recommended for use in barrel, rack, high speed and selective plating applications. The solution is operable over wide...
Techni IM Gold AT6100 Techni IM Gold AT6100 is a cyanide based immersion gold that deposits pore free gold without removing Ni. The Techni IM Gold AT6100 utilizes a proprietary electron donor that will...
Tin & Tin Alloy Alloy -- Techni NF JB 3000 NS Techni NF JB 3000 NS is a patented process which produces mirror bright pure tin deposits from an MSA electrolyte. The Techni NF JB 3000 NS process is designed for...
Tin & Tin Alloy Alloy -- Techni NF JB 3400 Techni NF JB 3400 is a unique process which produces mirror bright 90/10 or 60/40 tin/lead alloy deposits from an MSA electrolyte. The Techni NF JB 3400 process is designed...
Tin & Tin Alloy Alloy -- Techni NF JM 6000 / Techni NF JM 6000-LS Techni NF JM 6000 is designed specifically for high and medium speed electrodeposition of matte tin, 90/10 and 60/40 tin/lead alloys for electronic plating applications, such as connectors and components...
Techni Nickel HSG Techni Nickel HSG is an environmentally friendly process designed for high speed, high current density plating in a variety of electronic plating applications. Techni Nickel HSG produces a low stress,...
Techni Nickel HT-2 Techni Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to...
Techni Nickel TS Techni Nickel TS is a patented process designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit which provides protection from discoloration of...
Post-Treatment Processes -- Techni SBO-K2 Techni SBO-K2 minimizes epoxy bleed out without adversely affecting downstream assembly operations such as wire-bonding and die-attachment.
Techni Silver 1006 Techni Silver 1006 is an antimony brightened pure silver plating process that produces mirror bright ductile silver deposits with excellent wear resistance.
Techni Silver 1025 / Techni Silver 1050 Techni Silver 1025 is a selenium brightened pure silver plating process that produces semi-bright to mirror bright ductile silver deposits with excellent wear resistance, in rack and barrel and certain...
Techni Silver EHS 3R Techni Silver EHS 3R is a high speed silver plating solution designed to deposit pure silver in spot plating and other automatic machine applications from a phosphate electrolyte. The bath...
Techni Silver EHS 4 Techni Silver EHS 4 is a high speed silver plating solution recommended for use in applications that require deposits of high purity silver, high resistance to heat, and have excellent...
Techni-Gold 434HS Techni-Gold 434 HS is ideally suited to meet the pure soft gold requirements of wire bonding. Techni-Gold 434 HS Acid Pure Gold has been designed to produce a gold deposit...
Technic EN AT5600 Technic EN AT5600 is the first electroless nickel with a new family of organic stabilizer that produces lateral nickel growth on copper. Lateral growth yields a flatter surface with less...
Technic ISA Technic ISA Insoluble Anode System: The Technic ISA system eliminates high consumption of additives and utilizes copper oxide to maintain copper concentration in the plating solution. By eliminating soluble anodes,...
Technic Palladium AF Technic Palladium AF produces high purity palladium deposits suitable for wire bonding and solderability applications. . Technic Palladium AF is completely free of ammonia and as a result provides a...
Technic Palladium Nickel AF / Technic Palladium Nickel AF-LS Technic Palladium Nickel AF produces Pd-Ni alloy deposits from an electrolyte that is completely free of ammonia and as a result provides a safer working environment, free of ammonia fumes.
Technic Palladium Nickel VHS Technic Palladium Nickel VHS produces Pd-Ni alloy deposits that exhibit exceptional ductility and porosity from a conventional palladosamine chloride. Alloys containing 70 – 90% palladium can be achieved.
Technic Pallaspeed VHS Technic Pallaspeed VHS produces a pure palladium deposit that exhibits exceptional ductility and porosity from a conventional palladosamine chloride electrolyte.
Technic Orostrike C Technic’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high...
Leveltech Technic's Leveltech is an immersion tin process with a metallic additive which helps promote solderability and inhibit whisker growth associated with pure tin deposits. Leveltech can be used in either...
TechniFlex CU 120 TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over...
Electroless Nickel, Electroless Palladium, Immersion Gold -- TechniPad ENEPIG TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts.
TechniPulse 5300 TechniPulse 5300 has been specifically engineered for pulse periodic reverse or complex pulse wave applications. In the pulse mode the TechniPulse 5300 will produce an even, semi-bright deposit from a...
TechniSol Ag 2460 TechniSol Ag 2460 is a non-cyanide silver electrodeposition process used to enhance a silver paste seed layer or used as a solderable layer in a solar cell metal stack application.
TechniSol Cu 2440 TechniSol Cu 2440 is an electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits at 40 –
TechniSol Ni 2420 TechniSol Ni 2420 is an electrodeposition nickel process that can be used with Light Induced Plating or conventional electroplating. It is ideal for use as a barrier layer over alternative...
Tin & Tin Alloy Alloy -- Technistan Ag Technistan Ag is a patent-pending high speed plating process that deposits a semi-bright to full bright tin-silver alloy in the range of 90-99% tin. Technistan Ag deposits have an extremely...
Tin & Tin Alloy Electroplating -- Technistan EP Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic’s proprietary and patented mixed acid technology. The process produces a fine-grained matte tin deposit with...
Technistan HTM 4089 Technistan HTM 4089 is a High Throw Matte (HTM) tin sulfate process engineered to increase yields in advanced printed circuit boards. The Technistan HTM 4089 additive suppresses deposit thickness on...
Passive Component Electroplating -- Ceramistan 1031 The Ceramistan 1031 process produces a dense small grain deposit that provides excellent solderability, even after parts have been exposed to extended steam age testing. In addition, deposits from Ceramistan...
Passive Component Electroplating -- Ceramistan BR The CeramiStan BR process is a semi-bright pure tin plating solution specifically formulated for electroplating sensitive ceramic components, including low fired ceramic materials. It operates at an elevated pH range...
Pallaspeed Palladium Nickel NFA The Pallaspeed Pd/Ni NFA process is specifically designed to eliminate free ammonia, improving both worker and environmental safety through the elimination of harmful fumes. The process is also chloride free,...
Anodic, High Speed Silver Back-strip Solution -- Techni Silver Stripper 3500
Electrolytic Process for Stripping Copper, Nickel and Tin from Titanium or Stainless Steel Plating Racks -- Technistrip EL
The racks to be stripped are made anodic and the plated metal on the racks is dissolved into the electrolyte and subsequently deposited on steel or copper cathodes.
Tin & Tin Alloy Alloy -- Techni BT2 The Techni BT2 bright tin process is a low cost bright tin process based on sulfuric acid. It is designed for rack and barrel plating applications. The bright tin deposits...
High Speed Nickel Sulfamate FFP The Technic High Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit from either a sulfamate...
Silver and Copper -- Tarniban® Thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.
CUCN-Bright Copper Cyanide Process To provide a protective coat of copper over the base protect prior to subsequent plating.
Argentomerse NC Unlike most immersion silver processes on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 uin) of silver per minute on...
High Speed Tin Lead for Reel to Reel Strip Plating -- Techni NF JM 6000 Wide current density capability tin lead process based on MSA.