Technic, Inc. Datasheets for Plating Chemicals and Anodizing Chemicals

Plating chemical and anodizing chemicals include metal salts, formula additives, and other consumables for the electrodeposition, electroless plating, electroplating and anodized layer formation.
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Product Name Notes
34 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits...
TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of todayís complex printed circuit board designs. Providing excellent throwing power over a...
A cyanide based electrolytic gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate...
A cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and Techni IM Gold AT6100 additive. During this reaction Ni is...
A fully bright, leveled nickel deposit with high hardness and corrosion resistance.
A high speed silver plating process designed to operate with inert anodes and very low concentrations of free cyanide, over a wide CD range.
A high throwing power nickel sulfate bath that can improve distribution and reduce plating times on difficult to plate complex features.
A High-speed pure tin process that produces a deposit that is fine-grained with low organic impurities and is whisker resistant. The process is formulated to provide excellent coplanarity across the...
A low stress/highly corrosion resistant nickel deposit which protects over plated bright tin from discoloration during thermal exposure.
A low stress/highly corrosion resistant nickel deposit.
A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no...
A nickel-phosphorous alloy plating process which provides a deposit containing 6-11% Phosphorous for increased corrosion resistance in reel to reel electronic component and connector plating applications.
A non aqueous process which provides improved wera resistance and corrosion-resistant properties to Durasil® Silver deposits.
A post-treatment process offering maximum protection of tin deposits from discoloration in extreme dry heat thermal exposure conditions (e.g., reflow).
A proprietary silver alloy plating process designed to replace gold in reel to reel electronic component and connector applications. Provides excellent conductivity, superior corrosion resistance and improved wear resistance compared...
A semi to bright pyrophosphate copper solution used as an alternative to copper cyanide.
A silver plating process designed to operate with inert anodes and very low concentrations of free cyanide. Recommended where high purity, heat resistant deposits with excellent die and wire bonding...
A truly unique acid copper plating process specifically designed to meet the demands of today’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range.
Acid Gold with excellent adhesion on basis metals like nickel with high tolerance for resist contamination.
Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath.
All purpose nickel sulfamate bath that provides a low stress and ductile deposit. Low maintenance and long bath life are prominent attributes of this process.
An alkaline post-treatment process that effectively neutralizes acid films from tin and tin alloy plating process residues.
An extremely stable process capable of depositing over 10 microinches of Pd with a 2-3% phosphorus content. Techni EL Palladium AT7015 deposit is engineered for applications with gold wire bonding,...
Bright acid copper solution used for decorative and electroforming applications.
Bright cyanide copper especially design for difficult to plate substrates such as leaded brass.
Bright decorative finish for both rack and barrel plating.
Bright white sulfate high throw process.
Bright white sulfate process with excellent corrosion resistance.
Bright white sulfate process.
Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.
Brilliant decorative 24K hard gold 24K.
Brilliant white deposit for decorative applications.
Can be used as a nickel underplate or final finish. Easy to operate and control. Full bright deposit. A general purpose bath which should be recommended for all non-critical applications.
Ceramistan DM is a near-neutral pH matte tin or tin/lead plating process for standard chip capacitor/chip resistor barrel plating and/or SBE applications.
Chloride-free, low ammonia process exhibits superior corrosion resistance. Low stress. Operates at 100-500 ASF. Recommended undercoat for applications requiring gold flash.
Designed for application where a very white level deposit is required for the final nickel plate.
Designed for high bath loading in plating of steel, aluminum and metal alloys.
Designed for high bath loading in plating RoHS compliant mid phos nickel deposit on steel, aluminum and metal alloys. Bath is formulation to be auto ph adjusting.
Designed for high bath loading in plating RoHS compliant mid phos nickel deposit on steel, aluminum and metal alloys.
Designed to give good adhesion and coverage with a relative low level of thickness. This is followed by a high deposition bath.
Double sided screen priniter for flexible substrates.
Easy to use, low cost two component, analyzable.
Easy to use, stable PPR process yielding a bright deposit.
Electrolytic acid copper process specifically engineered to provide excellent throwing power and distribution. This process maintains superior performance over a wide range of current densities.
Electrolytic sulfite gold process that produces pure, soft gold deposits. Operates at an acidic pH, making it compatible with almost all photoresists. Elevate Gold 7990 produces a bright deposit without...
ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.
Exhibits improved copper and molding compound adhesion.
For smuts, hues, and highlights.
Formulation used for improved adhesion over difficult to plate base materials such as Kovar, Alloy 52 and Stainless Steel prior to subsequent plating.
Full bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Full bright process used for both strike and full build applications.
General purpose, low cost matte tin plating process for barrel plating applications.
Gold concentrate for 24K and color gold flash baths.
Gold plating process designed to minimize porosity in electronic component and connector barrel plating applications.
Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Gold strike for stainless steel.
Gold-tin alloy plating process that produces alloy ranges from 75 – 82% gold content with a corresponding melting point of 280°C – 320°C. Optimum gold-tin alloys are produced from a...
Green-yellow bright hard gold for heavy decorative deposits.
Hard Gold 24K--Type I, II Grade C designed for both rack and barrel operations.
High leveling one component system.
High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
High speed matte pure tin process based on sulfuric acid technology. Offers significant cost advantages to MSA systems.
High speed reel-to-reel process which produces ultra bright reflective surfaces on LED substrates.
High speed, phosphate based electrolyte designed for reel-to-reel and cut strip silver spot plating applications.
High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute can be attained on...
Industry standard for hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.
Low operating cost. Good product for most technology types. Optimum distribution in the range of 15 - 20 ASF.
Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
Low stress, excellent ductility designed for thin substrates.
Matte whisker resistant deposit. Recommended for rack/barrel applications (up to 4 ASD).
Medium grained, high speed, matte tin whisker resistant plating process based on MSA. Satisfies all requirements of JEDEC JESD 201. Can be formulated as a tin/lead process.
Mildly acidic platinum plating solution formulated for a variety of semiconductor applications including MEMS and fuel cells. The solution is particularly suitable for obtaining heavy deposits.
Mirror bright silver with excellent wear resistance.
Mirror-bright ductile decorative deposit with excellent wear resistance.
MSA tin process for use in rack, barrel and high speed RTR equipment. Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing...
Non-cyanide, semi-bright to bright silver plating process.
Non-foaming process providing a fine grained tin deposit.
One additive bright copper used for decorative and electroforming applications.
Operates over a wide CD range for increased output and flexibility in production. Produces brilliant deposits with good ductility. Exhibits good throwing power and distribution characteristics.
Organic, thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.
Organically brightened deposit for both rack and barrel operation.
Orosene 80RC is the industry standard colbalt brightened acid gold process. The deposit meets the requirements for type I and II, gradeC, of ASTM B488-01. The solution is compatible with...
Orosene 990 HS is a high speed, high efficiency hard gold formulation that mini- mizes hydrogen evolution and provides improved edge adhesion on dry film resists. It has a stable...
Pink, green and Ni standard alloy additives.
Post-treatment chemistry specifically designed for use after the Technistan Ag Sn-Ag alloy electroplating process.
Protects tin deposits from oxidation and discoloration following post-plate high temperature dry thermal exposure. Optimum results when used in combination with Techni Nickel TS. Recommended for rack, barrel and high...
Pure palladium process engineered for compatibility with aqueous dry film. Wide current density and metal concentration range. Typically utilized where better chemical resistance is required like in deep well applications.
Purified liquid concentrates providing a semi-bright finish.
Rack, barrel and mediuim speed reel-to-reel process which produces ultra bright reflective surfaces on LED substrates.
Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.
Recommended for protection of metal surfaces subjected to post plate salt spray corrosion testing (See ASTM B117). This product has been demonstrated to be effective on nickel, tin and thin...
Recommended for use in tin and tin alloy baths. Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath.
Replenishable PGC based immersion gold chemistry. It will deposit 2-4 microinches of gold on electroless nickel in 10 minutes. Techni IM Gold AT 6000 has a high tolerance for metallic...
Rhodium-look finish - lower costs can deposit directly on copper, nickel alloys without a strike.
Semi bright deposit to provide adhesion on difficult to plate metals.
Semi bright EN deposit, deposition rate 300-400 u/hr (7-10 u/hr).
Semi bright EN deposit, deposition rate 400-600 u-in/hr (10-15 um/hr). Highest level of corrosion resistance.
Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Semi bright strike process. Recommended for difficult to plate metals.
Silver final finish for solderability protection on solar cells.
Sulfate tin process for use in in rack, barrel and high speed RTR equipment. Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great...
Tarniban 60 is a post-treatment process which effectively protects silver deposits from oxidation/tarnishing especially when subjected to high thermal exposure environments. Tarniban 60 forms a thin, transparent film on the...
Tarniban C48 forms a thin, benign, transparent film on tin and tin alloy deposits and effectively protects them during exposure to high temperature / high humidity environments. Tarniban C48 minimizes...
Tarniban C50 offers similar benefits as the Tarniban C48 with added protection from extreme dry heat exposure (e.g., reflow).
Tarniban CBG is a post-treatment process which effectively protects gold plated surfaces from corrosion and oxidation. When used as directed, Tarniban CBG forms a thin, colorless, transparent film on the...
Tarniban KS II is a post-treatment process which effectively protects silver surfaces from oxidation/tarnishing. It may be used as an immersion only process or applied anodically for increased protection. When...
Techni Gold 1020C (HS) is a mildly acidic cobalt brightened gold plating solution recommended for use in high speed and selective plating applications. The solution operates at relatively low gold...
Techni Gold 300 is a mildly acidic nickel brightened gold plating solution recommended for use in barrel, rack, high speed and selective plating applications. The solution is operable over wide...
Techni IM Gold AT6100 is a cyanide based immersion gold that deposits pore free gold without removing Ni. The Techni IM Gold AT6100 utilizes a proprietary electron donor that will...
Techni NF JB 3000 NS is a patented process which produces mirror bright pure tin deposits from an MSA electrolyte. The Techni NF JB 3000 NS process is designed for...
Techni NF JB 3400 is a unique process which produces mirror bright 90/10 or 60/40 tin/lead alloy deposits from an MSA electrolyte. The Techni NF JB 3400 process is designed...
Techni NF JM 6000 is designed specifically for high and medium speed electrodeposition of matte tin, 90/10 and 60/40 tin/lead alloys for electronic plating applications, such as connectors and components...
Techni Nickel HSG is an environmentally friendly process designed for high speed, high current density plating in a variety of electronic plating applications. Techni Nickel HSG produces a low stress,...
Techni Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to...
Techni Nickel TS is a patented process designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit which provides protection from discoloration of...
Techni SBO-K2 minimizes epoxy bleed out without adversely affecting downstream assembly operations such as wire-bonding and die-attachment.
Techni Silver 1006 is an antimony brightened pure silver plating process that produces mirror bright ductile silver deposits with excellent wear resistance.
Techni Silver 1025 is a selenium brightened pure silver plating process that produces semi-bright to mirror bright ductile silver deposits with excellent wear resistance, in rack and barrel and certain...
Techni Silver EHS 3R is a high speed silver plating solution designed to deposit pure silver in spot plating and other automatic machine applications from a phosphate electrolyte. The bath...
Techni Silver EHS 4 is a high speed silver plating solution recommended for use in applications that require deposits of high purity silver, high resistance to heat, and have excellent...
Techni-Gold 434 HS is ideally suited to meet the pure soft gold requirements of wire bonding. Techni-Gold 434 HS Acid Pure Gold has been designed to produce a gold deposit...
Technic EN AT5600 is the first electroless nickel with a new family of organic stabilizer that produces lateral nickel growth on copper. Lateral growth yields a flatter surface with less...
Technic ISA Insoluble Anode System: The Technic ISA system eliminates high consumption of additives and utilizes copper oxide to maintain copper concentration in the plating solution. By eliminating soluble anodes,...
Technic Palladium AF produces high purity palladium deposits suitable for wire bonding and solderability applications. . Technic Palladium AF is completely free of ammonia and as a result provides a...
Technic Palladium Nickel AF produces Pd-Ni alloy deposits from an electrolyte that is completely free of ammonia and as a result provides a safer working environment, free of ammonia fumes.
Technic Palladium Nickel VHS produces Pd-Ni alloy deposits that exhibit exceptional ductility and porosity from a conventional palladosamine chloride. Alloys containing 70 – 90% palladium can be achieved.
Technic Pallaspeed VHS produces a pure palladium deposit that exhibits exceptional ductility and porosity from a conventional palladosamine chloride electrolyte.
Technic’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high...
Technic's Leveltech is an immersion tin process with a metallic additive which helps promote solderability and inhibit whisker growth associated with pure tin deposits. Leveltech can be used in either...
TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over...
TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts.
TechniPulse 5300 has been specifically engineered for pulse periodic reverse or complex pulse wave applications. In the pulse mode the TechniPulse 5300 will produce an even, semi-bright deposit from a...
TechniSol Ag 2460 is a non-cyanide silver electrodeposition process used to enhance a silver paste seed layer or used as a solderable layer in a solar cell metal stack application.
TechniSol Cu 2440 is an electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits at 40 –
TechniSol Ni 2420 is an electrodeposition nickel process that can be used with Light Induced Plating or conventional electroplating. It is ideal for use as a barrier layer over alternative...
Technistan Ag is a patent-pending high speed plating process that deposits a semi-bright to full bright tin-silver alloy in the range of 90-99% tin. Technistan Ag deposits have an extremely...
Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic’s proprietary and patented mixed acid technology. The process produces a fine-grained matte tin deposit with...
Technistan HTM 4089 is a High Throw Matte (HTM) tin sulfate process engineered to increase yields in advanced printed circuit boards. The Technistan HTM 4089 additive suppresses deposit thickness on...
The Ceramistan 1031 process produces a dense small grain deposit that provides excellent solderability, even after parts have been exposed to extended steam age testing. In addition, deposits from Ceramistan...
The CeramiStan BR process is a semi-bright pure tin plating solution specifically formulated for electroplating sensitive ceramic components, including low fired ceramic materials. It operates at an elevated pH range...
The Pallaspeed Pd/Ni NFA process is specifically designed to eliminate free ammonia, improving both worker and environmental safety through the elimination of harmful fumes. The process is also chloride free,...
The racks to be stripped are made anodic and the plated metal on the racks is dissolved into the electrolyte and subsequently deposited on steel or copper cathodes.
The Techni BT2 bright tin process is a low cost bright tin process based on sulfuric acid. It is designed for rack and barrel plating applications. The bright tin deposits...
The Technic High Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit from either a sulfamate...
Thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.
To provide a protective coat of copper over the base protect prior to subsequent plating.
Unlike most immersion silver processes on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 uin) of silver per minute on...
Wide current density capability tin lead process based on MSA.