Technic, Inc. Cobalt Hardened Gold Plating Process Techni Gold® 900

Description
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
  • Cobalt Hardened Gold Plating Process - Techni Gold® 900 - Technic, Inc.
    Technic, Inc.
Description
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Suppliers

Company
Product
Description
Supplier Links
Cobalt Hardened Gold Plating Process - Techni Gold® 900 - Technic, Inc.
Technic, Inc.
Cranston, RI, USA
Cobalt Hardened Gold Plating Process
Techni Gold® 900
Cobalt Hardened Gold Plating Process Techni Gold® 900
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Technical Specifications

  Technic, Inc.
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Techni Gold® 900
Product Name Cobalt Hardened Gold Plating Process
Chemical / Composition Gold Plating
Unlock Full Specs
to access all available technical data

Similar Products

Pure Palladium - - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Pure Palladium
Specs
Chemical / Composition Tin Plating
View Details
Coatings, Zinc Phosphate Process - Immersion - CrysCoat OC - Chemetall
Chemetall
Coatings, Zinc Phosphate Process - Immersion
CrysCoat OC
Specs
Chemical / Composition Zinc Plating
View Details
Electroplating Anodes - - Indium Corporation
Indium Corporation
Electroplating Anodes
Specs
Chemical / Composition Induim Plating
Form Bulk Solid / Granules
View Details
Tin & Tin Alloy Alloy - Technistan Ag - Technic, Inc.
Technic, Inc.
Tin & Tin Alloy Alloy
Technistan Ag
Specs
Chemical / Composition Tin Plating
View Details