Technic, Inc. Datasheets for Cleaning Agents and Surface Treatments

Cleaning agents and surface treatments includes liquid cleaners, degreasers, strippers, passivators, etchants, solutions and additives for cleaning and surface preparation.
Cleaning Agents and Surface Treatments: Learn more

Product Name Notes
A highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications. Developed to address laminated photo-resins and liquid resins, the novel stripping formulation of this...
A low sludge, low cost stripper based on nitric acid. High stripping rate (0.33-0.83 µm/second) with a high loading capacity for long solution life.
A specialty cleaner that stops electroless nickel from depositing in non-plated through holes (NPTH). When electroless copper is utilized for metallization it can leave Pd activator residues behind in NPTH.
A TMAH free solution that offers similar performance to the TechniStrip NF52. High resin dissolution and very good metal compatibility.
Acid salt with fluoride for nickel alloys, copper, brass activation. Similar to TAS-1, but more aggressive for hard to activate surfaces.
Acid salt, non-fluoride, replacement for mineral acids in pickling operations. Used to activate all base metals.
Acidic descaling processes for removing oxides and heat scale from base material substrates prior to subsequent electroplating applications.
Alkaline low foaming, chelated. Rapidly removes oils, grease, and other contaminants.
An acid cleaner specifically designed to wet copper surfaces and remove oxides from previous process steps is extremely important when processing product with blind vias and tight tolerances.
An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layer reworking. It is especially ideal for use in back end...
Blend of dry acid salts for pickling metals prior to electroplating.
Blend of dry acid salts for replacement of sulfuric and hydrochloric acid for pickling metals prior to electroplating.
Checmical process recommended to remove bleed and light flash from plastic semiconductor packages at lower operating temperatures.
Concentrated alkaline liquid cleaner for removing buffing compounds, tarnish and oxides from copper and brass.
Copper seed layer etchant providing selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal...
Creates hydrophobic surface to increase rinseability and reduce water staining.
Cyanide based gold stripper prepared from dry mix. Removes gold from most base metals.
Electrolytic stripper used on auto plating machines for removal of solder from Copper based substrate.
Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals.
Highly conductive electro-cleaner for removal of light oxide, oils and light buffing compound with excellent low recess cleaning.
Highly conductive electro-cleaner for removal of light oxide, oils and light buffing. Excellent risibility and wide temperature range.
Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.
Iodine based metal etchant for use with selective gold applications.
Liquid acid cleaner formulated for the removal of oxides, fingerprints, and light resist residues from copper seed layer surfaces prior to electrolytic copper plating.
Low Cost, Easy to Use, Free Rinsing, Will Not Etch / Ideal for Thin Copper Coatings.
Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.
Near neutral pH activation process to ensure proper adhesion and proper surface preparation prior to tin plating.
Non cyanide alkaline stripper designed to remove electroless or electrolytic nickel from copper.
oak cleaner for removal of most grease and oils from ferrous and non-ferrous metal.
Process designed to properly prepare aluminum and its alloys for electroless or electrolytic plating.
Recommended where a more aggressive etch is required.
Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXt, AZ40XT and AZnLOF 2000 series. High metal compatibility from a DMSO and TMAH free solution.
Technic Predip 470 is a single additive pre-treatment process which minimizes silver immersion deposits on copper/copper alloy substrates prior to silver plating.
Technic’s conventional electrolytic deflash products for removing mold flash and resin from IC components prior to subsequent electroplating operations. Techni Electro Deflash #4 operates at elevated pH levels while Techni...
Technic’s newly developed chemical deflash chemistry which operates in immersion mode followed by water jet for removal of mold flash and resin bleed from semiconductor packages sensitive to mold compound...
This process is specifically designed for efficient stripping of tin, tin-lead and/or nickel deposits from stainless steel belt and fingers of automated cut-strip plating equipment.
Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.
Used to deoxidize/activate copper based parts prior to electroplating.
Water based alkaline cleaner concentrate for ferrous and non-ferrous metals.