Technic, Inc. Technistan HTM 4089

Technistan HTM 4089 is a High Throw Matte (HTM) tin sulfate process engineered to increase yields in advanced printed circuit boards. The Technistan HTM 4089 additive suppresses deposit thickness on the surface creating a thicker deposit in the center of a high aspect ratio through hole or at the bottom of a blind microvia. Technistan HTM 4089 produces a very consistent fine grain deposit. This deposit along with it’s excellent throw provides exceptional resistance to final etchants. Because the additive is extremely stable, there are no amp hour adds. The additive is controlled by either periodic analysis and or standard adds based on acid drag out. This process also breaks out the Antiox # 8 as a separate analyzable material. This helps to maintain a clear solution by reducing levels of insoluble tin salts that are easily removed with the proper filtration. The main wetter used in the Technistan HTM 4089 helps to maintain a uniform fine grain deposit and controls burning with low tin concentrations. But as shown below on a hull cell test, the Technistan HTM 4089 wetter also provides suppression of plating in HCD areas.