An extremely stable process capable of depositing over 10 microinches of Pd with a 2-3% phosphorus content. Techni EL Palladium AT7015 deposit is engineered for applications with gold wire bonding, touch contacts, or slide contacts. The deposit improves chemical resistance required in a high corrosive environment such as deep well or under the hood. It produces a solderable deposit but requires a top coat of 1-2 micro inches of immersion gold.
| Technic, Inc. | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Techni EL Palladium AT7015 |
| Chemical / Composition | Electroless; Palladium |
