A low-stress copper bath that can be used for any application that requires a low-stress deposit such as a glass substrate. Plates at 1 – 2 microns/minute with virtually no internal stress.
| Technic, Inc. | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Elevate®Cu 6340 |
| Chemical / Composition | Copper Plating |
