Technic, Inc. Datasheets for Thin Film Equipment

Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
Thin Film Equipment: Learn more

Product Name Notes
Loading Options Cassette to Cassette Lead frames are loaded into the machine from dedicated cassettes moved by automated conveyor to the vacuum pickup head for insertion into the continuous moving...
System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and...
Available for a wide range of continuous processing applications, Technic equipment and chemistry is widely used throughout the industry. Technic’s Reel-to-Reel Plating Systems offer precise engineering, quality construction and some...
Designed for small scale testing of copper plating of PCBs plating Mini Electroless Copper Line – Standard Features Seven (7) polypropylene tanks 10 ½” x 6 ½” x 11” deep...
Designer for laboratory testing and sampling, Technic’s portable tabletop wafer plating test cell features all the tools needed to simulate full scale production. Specifications 16” long, 12” wide, 14” deep...
Light Induced Solar Plating of Front-Side Contacts (For Research and development applications) The plating station is 14"x28"x10" deep (approx. 12 gal.) constructed from ½" thick polypropylene with flange.
Mini Plating Plant 3 – Standard Features Four (4) polypropylene tanks 11” x 15” x 11” deep (7 gallon) Two (2) 1000 watt Teflon heaters with digital thermostats and low...
Mini Plating Plant 5 – Standard Features Six (6) polypropylene tanks 10 ½” x 6 ½” x 11” deep (3 gallon) Two (2) 500 watt Teflon heaters with digital thermostats...
Our 1-6 Model consists of two plating tanks (one nickel, one tin) with a two station rinse after each process. The unit is constructed from polypropylene, mounted to a stainless...
Our 2-6 Module provides double the production capability by providing a second row of stations in each tank. The 2-6 Model comes equipped with four SBE chambers.
SBE Systems is available in semiautomatic and fully automatic. The dual hoist system show here with consists of six nickel stations, dragout, cascade rinse, six tin stations, dragout and cascade...
Technic CU128 provides better throwing power with higher current density when compared to competitive processes. It is chemistry unique to Technic that provides superior control of grain structure and suppression...
Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled...
Technic offers two tab plater models the Mini FFP and the MP80. With over 700 Tab Plating machines worldwide, Technic provides most advanced technical support for both chemistry and equipment...
Technic’s EBA (Electroplating Bath Analyzer) provides an easy to implement, accurate and trouble-free analysis of your electroplating solutions. The EBA utilizes a patented combination of processing technique, software and hardware...
Technic’s Mini Mods are self-contained plating units with a built-in utility shelf for rectifiers, meters and additional controls. Mini Mod 2 - Standard Features Two (2) polypropylene tanks 11” x...
Technic’s Mini Mods are self-contained plating units with a built-in utility shelf for rectifiers, meters and additional controls. Mini Mod 3 - Standard Features Three (3) polypropylene tanks 10 ½”
Technic's CDP2000 is a precision electroplating machine designed for high accuracy controlled depth precious metal plating onto loose parts, typically for pins and sockets for the electronic connector industry. Considering...
Technic's EBA, unlike other control methods, it utilizes both DC & AC voltammetry for precise analysis of plating additives. Technic EBA provides precise measurements with real time data with SPC...
Technic's MP200 is a vertical plater that solves the problems with transport of thin materials in either roll or sheet form. It’s no touch transport stops handling defects from occurring...
Technic's patented method of electroplating small components such as electronic connectors, discs, pins and SMT chip capacitors and chip resistors.
The Flow Cell is designed for laboratory use or as a portable test unit to simulate high speed plating applications such as reel-to-reel or lead frame plating. The cell is...
The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well...
Vertical processing is widely acknowledged as the preferred method for achieving optimum side-to-side and edge-to-edge uniformity. Technic’s MP200CS is an advanced roll-to-roll wet processing system that offers a variety of...
Basket sizes: 160 mm to 360 mm in diameter. Basket material in PP or PVDF Transport from bath to bath – the vibration unit has to be fixed with a...
Basket sizes: 250 mm to 450 mm in diameter. Basket material in PP or PVDF Transport from bath to bath – The vibration unit has to be fixed with a...
Basket sizes: 90 mm and 160 mm in diameter Basket material in PP or PVDF Manually variable frequency and amplitude controls Manual transport from bath to bath – using standard...
Basket sizes: 90mm to 200 mm in diameter Basket material in PP or PVDF Transport from bath to bath – the vibration unit has to be fixed with a frame...
Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool...
Modular process cells and chassis construction allow for multiple plating and pretreat/post treat processes. Ergonomic design simplifies operation and maintenance. Slide-out process cells for easy maintenance access. Built-in exhaust control,...