Technic, Inc. Technic CU 2900

A truly unique acid copper plating process specifically designed to meet the demands of today’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range. Technic CU 2900 offers specific advantages: Low current density processing for improved distribution on demanding designs Increased production capacity on standard product The superior throwing power of Techni CU 2900 results in uniform deposits with good ductility and a fine-grained, equiaxed structure. The process utilizes a one-component system for amp-hour based replenishment. Individual components are available for optimization of specific applications. The additive system is extremely stable and completely analyzable by using Technic's patented Technic EBA