Technic, Inc. Technic Orostrike C

Description
Technic’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high current density range.
Description
Technic’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high current density range.

Suppliers

Company
Product
Description
Supplier Links
Technic Orostrike C -  - Technic, Inc.
Cranston, RI, USA
Technic Orostrike C
Technic Orostrike C
Technic’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high current density range.

Technic’s pure gold process for depositing ultra-thin layers of pure gold to enhance wire bonding / solderability performance in PPF applications. Operates at very low gold metal concentration with high current density range.

Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Plating Chemicals and Anodizing Chemicals
Product Name Technic Orostrike C
Chemical / Composition Gold Plating
Unlock Full Specs
to access all available technical data

Similar Products

ENTEK ® PLUS IC -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Heavy Phosphate - PavPhos MN - Pavco, Inc.
Specs
Chemical / Composition Zinc Plating
Form Liquid / Solution
View Details
Precious Metal Plating -  - Metalor Technologies USA Corporation
Metalor Technologies USA Corporation
View Details
Electroless Nickel Plating - MARQUEE® ENVY MP - Columbia Chemical Corporation
Specs
Chemical / Composition Hard Nickel Plating; Electroless
Form Liquid / Solution
View Details