Technic, Inc. Acid Copper Technic CU 2800

TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of todayís complex printed circuit board designs. Providing excellent throwing power over a wide current density range, Technic CU 2800 offers specific advantages in: Low current density processing for improved distribution on demanding designs Increased production capacity on standard product The superior throwing power of Technic CU 2800 results in uniform deposits with good ductility and a fine-grained equiaxed structure. The process utilizes a one-component system for amp-hour based replenishment. Individual components are available for optimization of specific applications. The additive system is extremely stable and completely analyzable. SUPERIOR LEVELING The brightener molecule, designed and manufactured by Technic, provides both grain refinement and leveling of the deposit. Unlike other systems that utilize high levels of sulfur bearing additives to level rough topography, Technic CU 2800 provides leveling without a third component that can negatively effect deposit performance.